International microsystems, packaging, assembly and circuits technology conference (IMPACT 2011): P1. Emerging systems packaging technologies

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI:10.1109/IMPACT.2011.6117178

T. Hofmann, S. Gottschling, B. Schuch, A. Neumann

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引用次数: 9

Abstract

The future challenges for electronic printed circuit boards in automotive applications is further miniaturization, while increasing reliability and reducing costs. Conventional approaches are limited by the latest circuit substrate requirements. Therefore innovative integration concepts and packaging technologies must be evaluated. For this purpose, Continental has managed VISA, a three-year project funded by the Federal Ministry for Education and Research, where electronic components are embedded into PCBs. The so-called i²Board concept was favourized, developed by Schweizer Electronic AG, in which active and/or passive components are mounted and connected onto an electrical substrate material comparable to a flex foil and already can be functionally tested. Afterwards, the assembly is embedded between the inner layers of the PCB and integrated into the PCB´s set up. Successful developments were conducted with regard to novel ferrite materials for the embedding of inductivities. Also results for bare dies embedded with new connection technologies, e.g. Cu-pillar-bumping for application for transmission control units are outlined

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国际微系统、封装、组装和电路技术会议(IMPACT 2011): P1。新兴系统封装技术

电子印刷电路板在汽车应用中的未来挑战是进一步小型化，同时提高可靠性和降低成本。传统方法受到最新电路基板要求的限制。因此，必须对创新集成概念和封装技术进行评估。为此，大陆集团管理了VISA，这是一个由联邦教育和研究部资助的为期三年的项目，其中电子元件被嵌入到pcb中。Schweizer Electronic AG开发的所谓i²Board概念受到青睐，其中有源和/或无源组件被安装并连接到与柔性箔相当的电子基板材料上，并且已经可以进行功能测试。之后，组装被嵌入在PCB的内层之间，并集成到PCB的设置中。在新型铁氧体电感嵌入材料方面取得了成功的进展。此外，还概述了嵌入新连接技术的裸模的结果，例如用于传输控制单元的铜柱碰撞

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2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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