I. Ndip, K. Andersson, Stefan Kosmider, T. H. Le, A. Kanitkar, M. van Dijk, Kavin Senthil Murugesan, U. Maass, T. Löher, Marco Rossi, J. Jaeschke, A. Ostmann, R. Aschenbrenner, M. Schneider-Ramelow, K. Lang
{"title":"A Novel Packaging and System-Integration Platform with Integrated Antennas for Scalable, Low-Cost and High-Performance 5G mmWave Systems","authors":"I. Ndip, K. Andersson, Stefan Kosmider, T. H. Le, A. Kanitkar, M. van Dijk, Kavin Senthil Murugesan, U. Maass, T. Löher, Marco Rossi, J. Jaeschke, A. Ostmann, R. Aschenbrenner, M. Schneider-Ramelow, K. Lang","doi":"10.1109/ectc32862.2020.00029","DOIUrl":null,"url":null,"abstract":"In this work, we present a novel packaging and system-integration platform with integrated antennas (antenna-in-package, AiP, platform) for 5G millimeter-wave (mmWave) systems. We illustrate the application of the platform for the development of miniaturized, scalable, low-cost and high-performance 5G mmWave systems for new radio (NR) base stations. RF characterization of the dielectric material of the platform and the integrated mmWave antennas as well as thermal investigations of the platform are presented. The process steps required for the fabrication of the platform are discussed, and an example of a mmWave chip embedded in the platform is shown.","PeriodicalId":6722,"journal":{"name":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","volume":"36 1","pages":"101-107"},"PeriodicalIF":0.0000,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ectc32862.2020.00029","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
In this work, we present a novel packaging and system-integration platform with integrated antennas (antenna-in-package, AiP, platform) for 5G millimeter-wave (mmWave) systems. We illustrate the application of the platform for the development of miniaturized, scalable, low-cost and high-performance 5G mmWave systems for new radio (NR) base stations. RF characterization of the dielectric material of the platform and the integrated mmWave antennas as well as thermal investigations of the platform are presented. The process steps required for the fabrication of the platform are discussed, and an example of a mmWave chip embedded in the platform is shown.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
