Tin Whisker Test Development—Temperature and Humidity Effects Part I: Experimental Design, Observations, and Data Collection

H. Reynolds, J. Osenbach, G. Henshall, R. Parker, P. Su
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引用次数: 18

Abstract

The effects of temperature and humidity on tin whisker growth were investigated through a collaborative project sponsored by the International Electronics Manufacturing Initiative (iNEMI) and its member companies. A broad range of testing conditions was adopted to test a variety of components with matte tin (Sn) plating and copper (Cu)-based leadframes. The primary goal of the study was to collect data that could be used to develop mathematical models (acceleration functions) that describe the dependence of tin whisker growth and corrosion on temperature and humidity. This paper describes the background, experimental design, data collection and reports results. Part II of the study (J. W. Osenbach et a. ?Tin whisker test development-Temperature and humidity effects part II: Acceleration model development,? Electronics Packaging Manufacturing, Vol. 33, no. 1, pp., Jan. 2010) discusses in the data analyses and acceleration model development. Storage testing was performed over a wide range of temperature and humidity conditions from 30?C to 100?C and from 10% to 90% relative humidity (RH). Commercially produced components with both 3 ?m and 10 ?m thicknesses from three sources were evaluated. For components with the 10 ?m-plating, the plating was evaluated in both the as-plated and reflowed (260?C) conditions. These variations resulted in a large experimental matrix that included 13 different Sn platings, aged at ten different temperature and humidity combinations. Further, the aging test was done at five different laboratories with inspections performed at eight different laboratories. The data collected include 1) corrosion incubation time, 2) tin whisker incubation time, and 3) dependence of the maximum whisker length on storage time at each temperature/humidity condition. Data suggest that corrosion is not a unique driving force for whisker initiation and growth. Whisker formation differs in corroded and non-corroded regions. Due to the scope of this work, it is broken down into two papers. The data and experimental observations are discussed in this paper. The mathematical model development, discussion of results and conclusions are included in Part II of this study.
锡晶须测试开发-温度和湿度影响第一部分:实验设计,观察和数据收集
温度和湿度对锡晶须生长的影响通过国际电子制造倡议(iNEMI)及其成员公司赞助的合作项目进行了研究。采用了广泛的测试条件来测试各种镀锡(Sn)和铜(Cu)基引线框架组件。这项研究的主要目标是收集数据,用于建立数学模型(加速函数),描述锡晶须生长和腐蚀对温度和湿度的依赖。本文介绍了研究背景、实验设计、数据收集和结果报告。研究的第二部分(J. W. Osenbach et a.)锡晶须测试的发展-温度和湿度的影响第二部分:加速模型的发展,电子封装制造Vol. 33 no. 331, pp, 2010年1月)讨论了数据分析和加速模型的开发。储存测试在温度和湿度从30?摄氏到一百度?室温,相对湿度10% ~ 90%。评估了来自三个来源的3 μ m和10 μ m厚度的商业生产组件。对于镀10°m的组件,在镀态和回流(260°C)条件下对镀层进行评估。这些变化导致了一个大的实验基质,其中包括13种不同的锡镀层,在10种不同的温度和湿度组合下老化。此外,老化测试在五个不同的实验室进行,并在八个不同的实验室进行检查。收集的数据包括:1)腐蚀培养时间;2)锡晶须培养时间;3)在不同温度/湿度条件下,最大晶须长度与储存时间的关系。数据表明,腐蚀并不是晶须产生和生长的唯一驱动力。腐蚀区域和非腐蚀区域的晶须形成不同。由于这项工作的范围,它被分为两篇论文。本文对数据和实验结果进行了讨论。第二部分包括数学模型的建立、结果的讨论和结论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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