35 nm floating gate planar MOSFET memory using double junction tunneling

R. Ohba, Y. Mitani, N. Sugiyama, S. Fujita
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引用次数: 1

Abstract

It is shown that, for 35 nm gate length, a silicon nitride trap memory using double junction tunneling can retain more than 4 decades memory window for 10 years in less than 9 volts w/e voltage, where 1E+6 w/e cycle endurance is attained simultaneously. This is due to Coulomb blockade and quantum confinement in Si nanocrystals lying between double tunnel oxides, and further improvement is possible by Si nanocrystal scaling. Therefore, the double junction tunneling SiN memory is an excellent candidate for less than 35nm region future memory
采用双结隧道的35nm浮栅平面MOSFET存储器
结果表明,对于35 nm栅极长度,采用双结隧道的氮化硅陷阱存储器可以在低于9伏w/e的电压下保持超过40年的记忆窗口10年,同时获得1E+6 w/e的循环寿命。这是由于位于双隧道氧化物之间的Si纳米晶体中的库仑封锁和量子限制,并且通过Si纳米晶体缩放可以进一步改善。因此,双结隧穿式SiN记忆体是未来小于35nm区域记忆体的理想选择
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