In situ cleaning/passivation of surfaces for contact technology on III-V materials

P. Rodriguez, L. Toselli, E. Ghegin, F. Nemouchi, N. Rochat, E. Martinez
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Abstract

In this work we introduce the use of physical plasmas (e.g. Ar- and He-based plasmas) in order to study the in situ cleaning (prior to metal deposition) of InGaAs layers dedicated to the realisation of self-aligned contacts. For the characterisation of cleaning efficiency, we performed surface analyses like X-ray photoelectron spectroscopy and Fourier transform infrared spectroscopy in attenuated total reflection mode. The first results described in this work are encouraging. We have found efficient processes for removing totally or partially III-V native oxides.
III-V材料接触技术表面的原位清洗/钝化
在这项工作中,我们介绍了物理等离子体(例如Ar基和he基等离子体)的使用,以研究用于实现自对准接触的InGaAs层的原位清洗(金属沉积之前)。为了表征清洁效率,我们在衰减全反射模式下进行了x射线光电子能谱和傅里叶变换红外能谱等表面分析。在这项工作中描述的第一个结果是令人鼓舞的。我们已经找到了完全或部分去除III-V原生氧化物的有效方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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