A Novel Nitric Acid Etchant and Its Application in Manufacturing Fine Lines for PCBs

IEEE Transactions on Electronics Packaging Manufacturing Pub Date : 2010-01-01 DOI:10.1109/TEPM.2009.2034534

Guoyun Zhou, Wei‐dong He, S. Wang, Y. Mo, K. Hu, B. He

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引用次数: 5

Abstract

We have developed a new etching solution for the printed circuit board industry. The primary oxidant of the solution is nitric acid, which reacts with copper coating on the substrate. The other components of the solution are sulfuric acid and additive, which are used to control etching reaction rate and solution's characteristics. The optimum parameters for the concentrations of nitric acid, sulfuric acid, additive, and the operating temperature were obtained through orthogonal experiment with stagnant etching method. The parameters were then verified by the spray etching experiment in the industrial production line. Then, there are a series of tests, carried out by metallographic slicing tester and scanning electron microscopy to evaluate the quality of copper conductive lines in stagnant and spray etching experiments. compared with conventional cupric chloride etchant, the testing results showed that the nitric acid etchant can manufacture fine lines with lower undercut, better wall sides, with higher etching rate, as well as being more friendly to the environment How the addition of H2SO4 influences etching rate and etching mechanism of nitric acid etchant is also discussed.

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一种新型硝酸蚀刻剂及其在pcb细线制造中的应用

我们为印刷电路板行业开发了一种新的蚀刻解决方案。溶液的主要氧化剂是硝酸，它与基材上的铜涂层发生反应。溶液的其他组分为硫酸和添加剂，用于控制蚀刻反应速率和溶液的特性。通过停滞蚀刻法正交试验，确定了硝酸、硫酸、添加剂浓度和操作温度的最佳参数。并在工业生产线上进行了喷蚀实验，验证了参数的正确性。然后，通过金相切片仪和扫描电镜对停滞和喷雾刻蚀实验中铜导线的质量进行了一系列的测试。实验结果表明，与传统的氯化铜蚀刻剂相比，硝酸蚀刻剂的蚀刻效果更好，蚀刻速率更高，蚀刻效果更好，对环境更友好。讨论了H2SO4的加入对硝酸蚀刻剂蚀刻速率的影响及蚀刻机理。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Electronics Packaging Manufacturing 工程技术-工程：制造

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