Ge-spacer technology in AlGaN/GaN HEMTs for mm-wave applications

T. Palacios, E. Snow, Y. Pei, A. Chakraborty, S. Keller, S. Denbaars, U. Mishra
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引用次数: 26

Abstract

GaN-based high electron mobility transistors (HEMTs) are the most promising option for power amplification at frequencies above 30 GHz. However, the difficult technology of nitride devices has hindered the aggressive scaling of these transistors needed for high frequency applications. Also, the need of a relatively thick passivation layer to avoid current collapse in these transistors has significantly limited the high frequency performance of the devices. In this paper, we introduces an advanced technology which uses a Ge sacrificial layer to fabricate passivated AlGaN/GaN HEMTs with gate lengths down to 90 nm, while maintaining a high breakdown voltage and minimum parasitic capacitances. Using these devices, we demonstrate record high frequency performance at both small and large signal levels
用于毫米波应用的AlGaN/GaN hemt中的ge间隔技术
基于氮化镓的高电子迁移率晶体管(hemt)是最有希望在30 GHz以上频率下进行功率放大的选择。然而,氮化器件的困难技术阻碍了高频应用所需的这些晶体管的积极缩放。此外,需要相对较厚的钝化层来避免这些晶体管中的电流崩溃,这大大限制了器件的高频性能。在本文中,我们介绍了一种先进的技术,该技术利用Ge牺牲层制备钝化AlGaN/GaN hemt,栅极长度低至90 nm,同时保持高击穿电压和最小寄生电容。使用这些器件,我们在小信号和大信号水平上都展示了创纪录的高频性能
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