A Handling Solution for Easy Processing of Thin Glass with TGV

Abstract

Glass substrates with through-glass vias for electronic packaging and radio-frequency substrate applications have been demonstrated in a variety of formats from wafers to panels, yet adoption has been hindered by difficulty in handling thin glass in the fab. In this paper we describe successful processing of glass wafers on silicon handles, using our polymer-free temporary bonding process. One preferred handle is silicon, so that the glass- on-silicon unit is rigid, opaque, and compatible with existing silicon-processing equipment. With the Mosaic bond approach, no adhesive wicks into the glass vias, allowing good via fill. Furthermore, no solvent is required for post-debond cleaning. In this paper, we demonstrate fundamental process capability for implementation of this technology for volume manufacture of glass solutions.