Tin Whisker Electrical Short Circuit Characteristics—Part II

K. Courey, S. Asfour, A. Onar, J. Bayliss, L. L. Ludwig, M. Wright
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引用次数: 16

Abstract

Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that has an unknown probability associated with it. Note however that due to contact resistance, electrical shorts may not occur at lower voltage levels. In our first paper, we developed an empirical probability model for tin whisker shorting. In this paper, we develop a more comprehensive empirical model using a refined experiment with a larger sample size, in which we studied the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From the resulting data, we estimated the probability distribution of an electrical short, as a function of voltage. In addition, the unexpected polycrystalline structure seen in the focused ion beam (FIB) cross section in the first experiment was confirmed in this experiment using transmission electron microscopy (TEM). The FIB was also used to cross section two card guides to facilitate the measurement of the grain size of each card guide's tin plating to determine its finish.
锡晶须电气短路特性。第2部分
现有的风险模拟假设,当一个自由的锡晶须桥接两个相邻的暴露的电导体时,结果是电短路。之所以做出这种保守的假设,是因为做空是一个随机事件,与之相关的概率是未知的。但请注意,由于接触电阻,在较低电压水平下可能不会发生电短路。在第一篇论文中,我们建立了锡晶须短路的经验概率模型。在本文中,我们使用更大样本量的改进实验开发了一个更全面的经验模型,其中我们研究了不同电压对接触电阻击穿导致短路的影响。从得到的数据中,我们估计了电气短路的概率分布,作为电压的函数。此外,在本实验中,通过透射电子显微镜(TEM)证实了第一次实验中聚焦离子束(FIB)截面中出现的意想不到的多晶结构。利用FIB对两个卡导轨进行横截面,方便测量每个卡导轨镀锡的晶粒尺寸,以确定其光洁度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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