An Efficient and Fast 112Gbps/PAM4 Signal Line Design with Conventional FCBGA Substrate Based on a 3-D Component Library

R. Oikawa
{"title":"An Efficient and Fast 112Gbps/PAM4 Signal Line Design with Conventional FCBGA Substrate Based on a 3-D Component Library","authors":"R. Oikawa","doi":"10.1109/ectc32862.2020.00156","DOIUrl":null,"url":null,"abstract":"This paper proposes and demonstrates a component library-based design that reduces 112Gbps signal design lead-time of LSI product package from months to several days with keeping design robustness against fabrication process deviation, as well as offering three-dimensional (3-D) electromagnetic (EM) simulation accuracy.","PeriodicalId":6722,"journal":{"name":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","volume":"25 1","pages":"956-963"},"PeriodicalIF":0.0000,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ectc32862.2020.00156","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

This paper proposes and demonstrates a component library-based design that reduces 112Gbps signal design lead-time of LSI product package from months to several days with keeping design robustness against fabrication process deviation, as well as offering three-dimensional (3-D) electromagnetic (EM) simulation accuracy.
基于三维元件库的传统FCBGA衬底高效快速112Gbps/PAM4信号线设计
本文提出并演示了一种基于元件库的设计,该设计将LSI产品封装的112Gbps信号设计前置时间从几个月减少到几天,同时保持设计对制造工艺偏差的稳健性,并提供三维(3-D)电磁(EM)仿真精度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信