A highly integrated 65-nm SoC process with enhanced power/performance of digital and analog circuits

L. Clark, D. Zhao, T. Bakhishev, H. Ahn, E. Boling, M. Duane, K. Fujita, P. Gregory, T. Hoffmann, M. Hori, D. Kanai, D. Kidd, S. Lee, Y. Liu, J. Mitani, J. Nagayama, S. Pradhan, P. Ranade, R. Rogenmoser, L. Scudder, L. Shifren, Y. Torii, M. Wojko, Y. Asada, T. Ema, S. Thompson
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引用次数: 21

Abstract

65nm Deeply Depleted Channel (DDCTM) transistors have been fabricated with a halo-free, un-doped epitaxial channel and enable reduced threshold voltage (VT) variation, lower supply voltage (VCC), enhanced body effect and IEFF. Digital circuits made using this technology show benefits ranging from 47% power reduction to 38% frequency increase. Analog circuits exhibit 4x greater amplifier gain despite lower VDD, and current mirror mismatch (both global and local) shows 40% and 30% reduction for NMOS and PMOS, respectively.
高度集成的65纳米SoC工艺,增强了数字和模拟电路的功率/性能
采用无光晕、未掺杂外延沟道制备了65nm深度耗尽沟道(DDCTM)晶体管,实现了降低阈值电压(VT)变化、降低电源电压(VCC)、增强体效应和IEFF的功能。使用该技术制造的数字电路显示出从降低47%的功率到增加38%的频率的好处。尽管VDD较低,但模拟电路的放大器增益提高了4倍,NMOS和PMOS的电流镜像失配(全局和局部)分别降低了40%和30%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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