Comparison the reliability of small plated-through hole with different diameters under thermal stress

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI:10.1109/IMPACT.2011.6117233

Jingyang Wu, Liao Meng-Chieh, Luo Tzeng-Cherng, Huang Te-Chun

{"title":"Comparison the reliability of small plated-through hole with different diameters under thermal stress","authors":"Jingyang Wu, Liao Meng-Chieh, Luo Tzeng-Cherng, Huang Te-Chun","doi":"10.1109/IMPACT.2011.6117233","DOIUrl":null,"url":null,"abstract":"As the demand grows for multiple functionality and high density, the reliability of plated-through hole becomes a concern because of the difficulty in small window plating. The reliability of PTH was affected by many factors, for instance, drilled diameter and plated thickness. In this study, we mainly concentrate on the impact of PTH diameter on it. The diameter of PTHs engaged in this experiment ranges from 10 mil to 60 mil on the multilayer printed circuit boards with 96 mil thickness. All the test boards are subjected to thermal cycle test for 6000 cycles: from 0°C to 100°C with 10°C per minute ramp rate. The failure data was analyzed by using two-parameter Weibull distribution. The experimental results show that diameter of PTH affect the reliability much more at small PTH size. In order to understand the failure modes, cross section was applied to failed PTHs, which show the PTH failures under thermal stress in this study were due to cracks at the middle of PTH barrel.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"21 1","pages":"161-164"},"PeriodicalIF":0.0000,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT.2011.6117233","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

Abstract

As the demand grows for multiple functionality and high density, the reliability of plated-through hole becomes a concern because of the difficulty in small window plating. The reliability of PTH was affected by many factors, for instance, drilled diameter and plated thickness. In this study, we mainly concentrate on the impact of PTH diameter on it. The diameter of PTHs engaged in this experiment ranges from 10 mil to 60 mil on the multilayer printed circuit boards with 96 mil thickness. All the test boards are subjected to thermal cycle test for 6000 cycles: from 0°C to 100°C with 10°C per minute ramp rate. The failure data was analyzed by using two-parameter Weibull distribution. The experimental results show that diameter of PTH affect the reliability much more at small PTH size. In order to understand the failure modes, cross section was applied to failed PTHs, which show the PTH failures under thermal stress in this study were due to cracks at the middle of PTH barrel.

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热应力作用下不同直径板通孔的可靠性比较

随着多功能性和高密度化需求的增长，小窗口电镀难度大，电镀通孔的可靠性成为人们关注的问题。PTH的可靠性受钻孔直径、镀层厚度等因素的影响。在本研究中，我们主要关注PTH直径对其的影响。在厚度为96 mil的多层印刷电路板上，实验所采用的PTHs直径范围为10 mil ~ 60 mil。所有测试板都经过6000个循环的热循环测试:从0°C到100°C，斜坡速率为每分钟10°C。采用双参数威布尔分布对失效数据进行分析。实验结果表明，当PTH尺寸较小时，PTH直径对可靠性的影响更大。为了了解PTH的破坏模式，我们对破坏的PTH进行了截面分析，结果表明，本研究中PTH在热应力作用下的破坏是由于PTH筒体中部的裂纹造成的。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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