Model updating of a temperature field simulation of a printed circuit board assembly based on the Kriging model

IF 1.7 4区材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Soldering & Surface Mount Technology Pub Date : 2021-07-01 DOI:10.1108/SSMT-01-2021-0002

Yin Yutian, Zhou Hongda, Chen Cai, Zheng Yi, Shen Hongqiao, Gong Yubing

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引用次数: 3

Abstract

Purpose The simulated temperature profile of the printed circuit board assembly (PCBA) during reflow soldering process deviates from the actual profile. To reduce this relative deviation, a new strategy based on the Kriging response surface and the Multi-Objective Genetic Algorithm (MOGA) optimizing method is proposed. Design/methodology/approach The simulated temperature profile of the PCBA during reflow soldering process deviates from the actual profile. To reduce this relative deviation, a new strategy based on the Kriging response surface and the MOGA optimizing method is proposed. Findings Several critical influencing parameters such as temperature and the convective heat transfer coefficient of the specific temperature zones are selected as the correction parameters. The hyper Latins sampling method is implemented to distribute the design points, and the Kriging response surface model of the soldering process is constructed. The updated model is achieved and validated by the test. The relative derivation is reduced from the initial value of 43.4%–11.8% in terms of the time above the liquidus line. Originality/value A new strategy based on the Kriging response surface and the MOGA optimizing method is proposed.

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基于Kriging模型的印刷电路板组件温度场仿真模型更新

目的模拟印制电路板组件回流焊过程中的温度曲线与实际温度曲线存在较大偏差。为了减小这种相对偏差，提出了一种基于Kriging响应面和多目标遗传算法(MOGA)的优化策略。设计/方法/方法回流焊过程中PCBA的模拟温度曲线与实际温度曲线有偏差。为了减小这种相对偏差，提出了一种基于Kriging响应面和MOGA优化方法的新策略。结果选取了温度和特定温区对流换热系数等关键影响参数作为修正参数。采用超拉丁采样法对设计点进行分布，建立了焊接过程的克里金响应面模型。通过测试实现并验证了更新后的模型。相对导数在初始值43.4% ~ 11.8%的基础上，随着时间的推移而减小。提出了一种基于Kriging响应面和MOGA优化方法的新策略。

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来源期刊

Soldering & Surface Mount Technology 工程技术-材料科学：综合

CiteScore

4.10

自引率

15.00%

发文量

审稿时长

>12 weeks

期刊介绍： Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.