Comments on "Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging

H. Yin
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引用次数: 4

Abstract

An approach previously developed by Suhir in 1986 for calculating the interfacial compliance of a long-narrow strip is a general, explicit method, but Basaran and Wen claimed that there had been an error in the derivation. Using an additional approximation, they obtained a different form of longitudinal interfacial compliance. However, that approximation is not appropriate. Disregarding it, we can see that their result is the same as Suhir's result. However, a minor inconsistence in Suhir's derivation is still found. The applicability and modification of Suhir's model are discussed.
“界面顺应性对多层微电子封装中热机械应力的影响”一文述评
Suhir早在1986年就提出了一种计算狭长带的界面柔顺性的方法,这是一种通用的显式方法,但Basaran和Wen声称推导过程中存在错误。使用额外的近似,他们获得了一种不同形式的纵向界面顺应性。然而,这种近似是不合适的。不考虑它,我们可以看到他们的结果和Suhir的结果是一样的。然而,在Suhir的推导中仍然发现了一个小的矛盾。讨论了Suhir模型的适用性和修正问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Advanced Packaging
IEEE Transactions on Advanced Packaging 工程技术-材料科学:综合
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