3-D Logic Circuit Design-Oriented Electrothermal Modeling of Vertical Junctionless Nanowire FETs

Abstract

This work presents new insights into 3-D logic circuit design with vertical junctionless nanowire FETs (VNWFET) accounting for underlying electrothermal phenomena. Aided by the understanding of the nanoscale heat transport in VNWFETs through multiphysics simulations, the SPICE-compatible compact model captures temperature and trapping effects principally through a shift of the device threshold voltage. Circuit-level simulations indicate a strong impact of temperature variation on functionality and figures of merits, such as energy-delay products. Subsequent guidelines for design considerations are discussed that are intended to provide feedback for technology improvements.