Improvement of the heat resistance of a liquid mold compound by bismaleimide resin

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2023-04-01 DOI:10.1016/j.microrel.2023.114933

Yuki Ishikawa , Tomoya Takao , Takeyasu Saito

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Abstract

For next-generation power semiconductors, a highly heat-resistant liquid mold compound was developed based on an epoxy resin having a functional group that can react with bismaleimide (BMI) resin. A liquid resin with a maleimide skeleton was created by prereacting BMI, which has a low melting point of 70–150 °C, with an epoxy resin having allyl and epoxide groups. The maleimide-skeleton epoxy resin was able to precure at ≤150 °C using peroxide and imidazole curing agents. The liquid maleimide-modified epoxy mold compound (EMC) containing silica filler had not a clear glass transition temperature, so the change in physical properties to temperature is very small. This study compared the heat resistance of the developed maleimide-modified liquid mold compound with a general-purpose EMC and silicone gel. The weight loss at 200 °C was less than that of the EMC, and changes in physical properties, which are important for mold compounds, were also small, indicating excellent heat resistance. Therefore, a liquid mold compound containing maleimide resin is likely to be suitable as a mold compound for power semiconductor devices operating at 200 °C.

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双马来酰亚胺树脂改善液态模塑化合物的耐热性

对于下一代功率半导体，基于具有可与双马来酰亚胺（BMI）树脂反应的官能团的环氧树脂，开发了一种高度耐热的液体模塑化合物。通过将BMI与具有烯丙基和环氧化物基团的环氧树脂预反应，制备出具有马来酰亚胺骨架的液体树脂，BMI具有70–150°C的低熔点。马来酰亚胺骨架环氧树脂能够使用过氧化物和咪唑固化剂在≤150°C下预固化。含有二氧化硅填料的液态马来酰亚胺改性环氧模塑化合物（EMC）没有明确的玻璃化转变温度，因此物理性能随温度的变化很小。本研究将所开发的马来酰亚胺改性液体模塑化合物与通用EMC和硅胶的耐热性进行了比较。200°C下的重量损失小于EMC，物理性能的变化也很小，这对模具化合物很重要，表明其具有优异的耐热性。因此，含有马来酰亚胺树脂的液态模塑化合物可能适合作为在200°C下工作的功率半导体器件的模塑化合物。

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.