Compact dual-mode microstrip bandpass filter based on slotted square patch resonator

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
K. S., Zuvairiya Parveen J., Y. D., Venkadeshwari E.
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引用次数: 4

Abstract

Purpose The purpose of this paper is to present the design of a compact microstrip bandpass filter (BPF) in dual-mode configuration loaded with cross-loop and square ring slots on a square patch resonator for C-band applications. Design/methodology/approach In the proposed design, the dual-mode response for the filter is realized with two transmission zeros (TZs) by the insertion of a perturbation element at the diagonal corner of the square patch resonator with orthogonal feed lines. Such TZs at the edges of the passband result in better selectivity for the proposed BPF. Moreover, the cross-loop and square ring slots are etched on a square patch resonator to obtain a miniaturized BPF. Findings The proposed dual-mode microstrip filter fabricated in RT/duroid 6010 substrate using PCB technology has a measured minimum insertion loss of 1.8 dB and return loss better than 24.5 dB with a fractional bandwidth (FBW) of 6.9%. A compact size of 7.35 × 7.35 mm2 is achieved for the slotted patch resonator-based dual-mode BPF at the center frequency of 4.76 GHz. As compared with the conventional square patch resonator, a size reduction of 61% is achieved with the proposed slotted design. The feasibility of the filter design is confirmed by the good agreement between the measured and simulated responses. The performance of the proposed filter structure is compared with other dual-mode filter works. Originality/value In the proposed work, a compact dual-mode BPF is reported with slotted structures. The conventional square patch resonator is deployed with cross-loop and square ring slots to design a dual-mode filter with a square perturbation element at its diagonal corner. The proposed filter exhibits compact size and favorable performance compared to other dual-mode filter works reported in literature. The aforementioned design of the dual-mode BPF at 4.76 GHz is suitable for applications in the lower part of the C-band.
基于缝隙方形贴片谐振器的紧凑型双模微带带通滤波器
本文的目的是设计一种适用于C波段应用的紧凑型微带带通滤波器(BPF),该滤波器采用双模配置,在方形贴片谐振器上加载交叉环和方形环槽。设计/方法/方法在所提出的设计中,通过在具有正交馈线的方形贴片谐振器的对角处插入扰动元件,实现了具有两个传输零点(TZ)的滤波器的双模响应。通带边缘处的这种TZ导致所提出的BPF具有更好的选择性。此外,在方形贴片谐振器上蚀刻交叉环和方形环槽,以获得小型化的BPF。发现所提出的采用PCB技术在RT/硬质合金6010衬底上制造的双模微带滤波器的最小插入损耗为1.8 dB,回波损耗优于24.5 dB,分数带宽(FBW)为6.9%。紧凑型尺寸为7.35 × 在4.76的中心频率下,基于缝隙片谐振器的双模BPF实现了7.35mm2 GHz。与传统的方形贴片谐振器相比,所提出的开槽设计实现了61%的尺寸减小。滤波器设计的可行性通过测量和模拟响应之间的良好一致性得到了证实。将所提出的滤波器结构的性能与其他双模滤波器进行了比较。原创性/价值在所提出的工作中,报道了一种具有开槽结构的紧凑双模BPF。传统的方形贴片谐振器采用交叉环槽和方形环槽,设计了一个对角具有方形扰动单元的双模滤波器。与文献中报道的其他双模滤波器相比,所提出的滤波器具有紧凑的尺寸和良好的性能。上述4.76双模BPF的设计 GHz适用于C波段较低部分的应用。
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来源期刊
Microelectronics International
Microelectronics International 工程技术-材料科学:综合
CiteScore
1.90
自引率
9.10%
发文量
28
审稿时长
>12 weeks
期刊介绍: Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.
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