Effect of alloy particle size and stencil aperture shape on solder printing quality

IF 0.7 4区工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics International Pub Date : 2022-05-05 DOI:10.1108/mi-12-2021-0121

M. S. Mohamed Sunar, M. Abu Bakar, A. Jalar, Mohamad Riduwan Ramli, F. Che Ani

{"title":"Effect of alloy particle size and stencil aperture shape on solder printing quality","authors":"M. S. Mohamed Sunar, M. Abu Bakar, A. Jalar, Mohamad Riduwan Ramli, F. Che Ani","doi":"10.1108/mi-12-2021-0121","DOIUrl":null,"url":null,"abstract":"\nPurpose\nReflow solder joint quality is significantly affected by the ability of the solder to perfectly fill pad space and retain good solder joint shape. This study aims to investigate solder joint quality by quantitatively analyzing the stencil printing-deposited solder volume, solder height and solder coverage area.\n\n\nDesign/methodology/approach\nThe dispensability of different solder paste types on printed circuit board (PCB) pads using different stencil aperture shapes was evaluated. Lead-free Type 4 (20–38 µm particle size) and Type 5 (15–25 µm particle size) solder pastes were used to create solder joints according to standard reflow soldering.\n\n\nFindings\nThe results show that the stencil aperture shape greatly affects the solder joint quality as compared with the type of solder paste. These investigations allow the development of new strategies for solving solder paste stencil printing issues and evaluating the quality of solder joints.\n\n\nOriginality/value\nThe reflow soldering process requires the appropriate selection of the stencil aperture shape according to the PCB and the solder paste according to the particle-size distribution of the solder alloy powder. However, there are scarce studies on the effects of stencil aperture shape and the solder alloy particle size on the solder paste space-filling ability.\n","PeriodicalId":49817,"journal":{"name":"Microelectronics International","volume":null,"pages":null},"PeriodicalIF":0.7000,"publicationDate":"2022-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics International","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1108/mi-12-2021-0121","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 1

Abstract

Purpose Reflow solder joint quality is significantly affected by the ability of the solder to perfectly fill pad space and retain good solder joint shape. This study aims to investigate solder joint quality by quantitatively analyzing the stencil printing-deposited solder volume, solder height and solder coverage area. Design/methodology/approach The dispensability of different solder paste types on printed circuit board (PCB) pads using different stencil aperture shapes was evaluated. Lead-free Type 4 (20–38 µm particle size) and Type 5 (15–25 µm particle size) solder pastes were used to create solder joints according to standard reflow soldering. Findings The results show that the stencil aperture shape greatly affects the solder joint quality as compared with the type of solder paste. These investigations allow the development of new strategies for solving solder paste stencil printing issues and evaluating the quality of solder joints. Originality/value The reflow soldering process requires the appropriate selection of the stencil aperture shape according to the PCB and the solder paste according to the particle-size distribution of the solder alloy powder. However, there are scarce studies on the effects of stencil aperture shape and the solder alloy particle size on the solder paste space-filling ability.

查看原文本刊更多论文

合金颗粒尺寸和模版孔径形状对焊料印刷质量的影响

目的回流焊点质量受焊料完美填充焊盘空间和保持良好焊点形状的能力的显著影响。本研究旨在通过定量分析丝网印刷沉积的焊料体积、焊料高度和焊料覆盖面积来研究焊点质量。设计/方法/方法评估了使用不同模版孔径形状的印刷电路板（PCB）焊盘上不同焊膏类型的可有可无性。根据标准回流焊，使用无铅4型（20–38µm颗粒尺寸）和5型（15–25µm颗粒大小）焊膏来创建焊点。结果表明，与焊膏类型相比，模版孔径形状对焊点质量有很大影响。这些研究为解决焊膏模版印刷问题和评估焊点质量提供了新的策略。独创性/价值回流焊工艺需要根据PCB选择合适的模版孔径形状，并根据焊料合金粉末的粒度分布选择焊膏。然而，关于模版孔径形状和焊料合金颗粒尺寸对焊膏空间填充能力的影响的研究很少。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Microelectronics International 工程技术-材料科学：综合

CiteScore

1.90

自引率

9.10%

发文量

审稿时长

>12 weeks

期刊介绍： Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.