Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling

IF 1.7 4区材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Soldering & Surface Mount Technology Pub Date : 2020-11-16 DOI:10.1108/ssmt-06-2020-0028

Buen Zhang, N. Jabarullah, A. Alkaim, S. Danshina, I. Krasnopevtseva, Yuan Zheng, N. Geetha

引用次数: 8

Abstract

Purpose This paper aims to establish a more accurate model for lifetime estimation. Design/methodology/approach Finite element model simulation and experimental tests are used to enhance the lifetime prediction model of the solder joint. Findings A more precise model was found. Originality/value It is confirmed that the paper is original.

查看原文本刊更多论文

一种新的基于能量的功率半导体焊点热机械疲劳寿命评估方法

目的建立一个更精确的寿命估计模型。设计/方法/方法采用有限元模型仿真和实验测试来增强焊点的寿命预测模型。发现了一个更精确的模型。原创性/价值经确认该论文为原创。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Soldering & Surface Mount Technology 工程技术-材料科学：综合

CiteScore

4.10

自引率

15.00%

发文量

审稿时长

>12 weeks

期刊介绍： Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.