Liyun Li, Yu Zhang, Shiyu Xia, Zhefei Sun, Junjie Yuan, D. Su, H. Cao, X. Chai, Qingtian Wang, Jintang Li, Zhihao Zhang
{"title":"Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles","authors":"Liyun Li, Yu Zhang, Shiyu Xia, Zhefei Sun, Junjie Yuan, D. Su, H. Cao, X. Chai, Qingtian Wang, Jintang Li, Zhihao Zhang","doi":"10.1108/mi-11-2022-0186","DOIUrl":null,"url":null,"abstract":"\nPurpose\nThis study aims to develop a facile ligand-exchange strategy to promote nano-sintering of oleylamine (OAM)-capped silver nanoparticles (AgNPs). By using ligand exchange process with NH4OH to remove OAM from the surface of AgNP, this study reports effectively reducing the sintering temperature of AgNPs to achieve low-temperature nano-sintering. Compared with untreated AgNPs of OAM-capped, NH4OH-treated AgNPs possess superior sintering performance that could be applied to a fractional generator device as conductor and in favour of the fabrication of flexible circuit modules.\n\n\nDesign/methodology/approach\nFirst, oleylamine is used as reductant to synthesize monodisperse AgNPs by a simple one-step method. Then ligand exchange is used with NH4OH at different treating times to remove OAM, and micro-Fourier transform infrared spectroscopy and contact angle test are applied to clear the mechanism and structure characteristics of these processes. Finally, NH4OH-treated AgNPs sediment sintering is used at different temperatures to test electrical resistivity and use ex situ scanning electron microscopy combined with in situ X-ray diffraction to study changes in microstructure in the whole nano-sintering process.\n\n\nFindings\nThe AgNPs are always capped by organic ligands to prevent nanoparticles agglomeration. And oleylamine used as reductant could synthesize desirable size distributions of 8–32 nm with monodisperse globular shapes, but the low-temperature nano-sintering seemed not to be achieved by the oleylamine-capped AgNPs because OAM is an organic with long C-chain. The ligand exchange approach was enabled to replace the original organic ligands capped on AgNPs with organic ligands of low thermal stability which could promote nano-sintering. After ligand exchange treated AgNPs could be sintered on photo paper, polydimethylsiloxane (PDMS) and polyethylene terephthalate flexible substrates at low temperature.\n\n\nOriginality/value\nIn this research, the method ligand exchange is used to change the ligand of AgNPs. During ligand exchange, NH4OH was used to treat AgNPs. Through the treatment of NH4OH, the change of hydrophilic and hydrophobic properties of AgNPs was successfully realized. The sintering temperature of AgNPs can also be reduced and the properties can be improved. Finally, the applicability of the AgNPs sediment with this nano-sintering process at low temperature for obtaining conductive patterns was evaluated using PDMS as substrates.\n","PeriodicalId":49817,"journal":{"name":"Microelectronics International","volume":null,"pages":null},"PeriodicalIF":0.7000,"publicationDate":"2023-01-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics International","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1108/mi-11-2022-0186","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Purpose
This study aims to develop a facile ligand-exchange strategy to promote nano-sintering of oleylamine (OAM)-capped silver nanoparticles (AgNPs). By using ligand exchange process with NH4OH to remove OAM from the surface of AgNP, this study reports effectively reducing the sintering temperature of AgNPs to achieve low-temperature nano-sintering. Compared with untreated AgNPs of OAM-capped, NH4OH-treated AgNPs possess superior sintering performance that could be applied to a fractional generator device as conductor and in favour of the fabrication of flexible circuit modules.
Design/methodology/approach
First, oleylamine is used as reductant to synthesize monodisperse AgNPs by a simple one-step method. Then ligand exchange is used with NH4OH at different treating times to remove OAM, and micro-Fourier transform infrared spectroscopy and contact angle test are applied to clear the mechanism and structure characteristics of these processes. Finally, NH4OH-treated AgNPs sediment sintering is used at different temperatures to test electrical resistivity and use ex situ scanning electron microscopy combined with in situ X-ray diffraction to study changes in microstructure in the whole nano-sintering process.
Findings
The AgNPs are always capped by organic ligands to prevent nanoparticles agglomeration. And oleylamine used as reductant could synthesize desirable size distributions of 8–32 nm with monodisperse globular shapes, but the low-temperature nano-sintering seemed not to be achieved by the oleylamine-capped AgNPs because OAM is an organic with long C-chain. The ligand exchange approach was enabled to replace the original organic ligands capped on AgNPs with organic ligands of low thermal stability which could promote nano-sintering. After ligand exchange treated AgNPs could be sintered on photo paper, polydimethylsiloxane (PDMS) and polyethylene terephthalate flexible substrates at low temperature.
Originality/value
In this research, the method ligand exchange is used to change the ligand of AgNPs. During ligand exchange, NH4OH was used to treat AgNPs. Through the treatment of NH4OH, the change of hydrophilic and hydrophobic properties of AgNPs was successfully realized. The sintering temperature of AgNPs can also be reduced and the properties can be improved. Finally, the applicability of the AgNPs sediment with this nano-sintering process at low temperature for obtaining conductive patterns was evaluated using PDMS as substrates.
期刊介绍:
Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details.
Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are:
• Advanced packaging
• Ceramics
• Chip attachment
• Chip on board (COB)
• Chip scale packaging
• Flexible substrates
• MEMS
• Micro-circuit technology
• Microelectronic materials
• Multichip modules (MCMs)
• Organic/polymer electronics
• Printed electronics
• Semiconductor technology
• Solid state sensors
• Thermal management
• Thick/thin film technology
• Wafer scale processing.