Au-coated Ag alloy bonding wires with enhanced oxidation resistance for electronic packaging applications

IF 0.7 4区工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics International Pub Date : 2022-09-21 DOI:10.1108/mi-08-2022-0158

Yuchen Xiao, H. Tang, Hehe Zhang, Xiaoling Yang, Ling Sun, Yong Xie, Baoan Wu, B. Luan, W. Xie, X. Cai

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引用次数: 0

Abstract

Purpose The purpose of this paper is to develop high-performance Au-coated Ag alloy wires (ACAA wires) and demonstrate the effect of Au coating layers on the bonding performance and oxidation resistance for stable and reliable electronic packaging applications. Design/methodology/approach ACAA wire with a diameter of approximately 25 µm and Au layer thickness of approximately 100 nm were prepared by the continuous casting, plating and wire drawing method. The bonding performance of the ACAA wires were studied through bonding on 3,535 chips. The oxidation resistance of ACAA wires and Ag alloy wires (AA wires) were comparatively studied by means of chemical oxidation tests, accelerated life tests and electrochemical tests systematically. Findings ACAA wires could form axi-symmetrical spherical free air balls with controllable diameter of 1.5∼2.5 times of the wire diameter after electric flame-off process. The ball shear strength of ACAA wire was higher than that of AA wires. Most importantly, because of the surface Au coating layer, the oxidation resistance of ACAA wires was much enhanced. Research limitations/implications ACAA wires with different lengths of heat affected zone were not developed in this study, which limited their application with different loop height requirements. Practical implications With higher bonding strength and oxidation resistance, ACAA wires would be a better choice than previous reported AA wire in chip packaging which require high stability and reliability. Originality/value This paper provides a kind of novel ACAA wire, which possess the merits of high bonding strength and reliability, and show great potential in electronic packaging applications.

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电子封装应用中抗氧化性增强的Au涂层Ag合金键合线

目的研制高性能镀金银合金线(ACAA线)，并研究镀金层对其键合性能和抗氧化性能的影响，从而实现稳定可靠的电子封装应用。采用连续铸造、电镀和拉丝的方法制备了直径约为25 μ m、金层厚度约为100 nm的acaa金属丝。通过在3535个芯片上的键合，研究了ACAA导线的键合性能。采用化学氧化试验、加速寿命试验和电化学试验等方法，系统地比较研究了ACAA丝和Ag合金丝(AA丝)的抗氧化性能。结果表明，sacaa丝经电燃后可形成直径为丝径1.5 ~ 2.5倍可控的轴对称球形自由空气球。ACAA丝的球抗剪强度高于AA丝。最重要的是，由于表面有一层Au涂层，使得ACAA导线的抗氧化性大大提高。研究局限性/意义本研究未开发具有不同热影响区长度的acaa导线，这限制了其在不同环路高度要求下的应用。实际意义ACAA线具有更高的结合强度和抗氧化性，在要求高稳定性和可靠性的芯片封装中，ACAA线将是比先前报道的AA线更好的选择。本文提供了一种新型的ACAA线，具有高的结合强度和可靠性，在电子封装方面具有很大的应用潜力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Microelectronics International 工程技术-材料科学：综合

CiteScore

1.90

自引率

9.10%

发文量

审稿时长

>12 weeks

期刊介绍： Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.