An investigation on mechanical random vibration fatigue damage of solder joints in electronic systems

IF 1.7 4区材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Soldering & Surface Mount Technology Pub Date : 2020-11-11 DOI:10.1108/ssmt-07-2020-0031

Feng Wang, Fangfang Zhang, Qixiang Huang, M. Salmani

引用次数: 2

Abstract

Purpose The purpose of this paper is to propose a method with capability of short-time implementation. Design/methodology/approach This paper was directed using both experimental tests and simulations to propose a comprehensive method for lifetime estimation of the solder joints. Findings A new method with good agreement with experimental tests has been proposed. Originality/value It is confirmed that paper is original.

查看原文本刊更多论文

电子系统中焊点机械随机振动疲劳损伤研究

目的本文的目的是提出一种具有短时实现能力的方法。设计/方法/方法本文通过实验测试和模拟，提出了一种全面的焊点寿命估计方法。发现提出了一种与实验结果吻合较好的新方法。独创性/价值经确认，纸张是原创的。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Soldering & Surface Mount Technology 工程技术-材料科学：综合

CiteScore

4.10

自引率

15.00%

发文量

审稿时长

>12 weeks

期刊介绍： Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.