Useful lifetime estimation of solder joints in power semiconductors employed in current source and voltage source inverters

IF 1.7 4区材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Soldering & Surface Mount Technology Pub Date : 2020-12-28 DOI:10.1108/ssmt-05-2020-0018

Hao Zou, Fang Xie, Bo-Sian Du, G. Kavithaa

引用次数: 0

Abstract

Purpose The purpose of this paper is to find the optimum inverter type as the solder joint reliability point of view. Design/methodology/approach In this paper, finite element model(ing) simulations supported with power cycling aging experiments were used to demonstrate the best inverter type as the solder joint reliability point of view. Findings It was found that inverter types highly affect the solder joint health during its nominal operating. Originality/value The authors confirm the originality of this paper.

查看原文本刊更多论文

用于电流源和电压源逆变器的功率半导体焊点的使用寿命估计

目的从焊点可靠性的角度出发，寻找最佳的逆变器类型。设计/方法/方法在本文中，从焊点可靠性的角度出发，使用有限元模型模拟和功率循环老化实验来证明最佳逆变器类型。研究发现，逆变器类型在其标称运行期间对焊点健康有很大影响。作者确认了这篇论文的独创性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Soldering & Surface Mount Technology 工程技术-材料科学：综合

CiteScore

4.10

自引率

15.00%

发文量

审稿时长

>12 weeks

期刊介绍： Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.