Microfabrication of double proof-mass SOI-based matryoshka-like structures for 3-axis MEMS accelerometers

IF 2.8 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Inês S. Garcia , José Fernandes , José B. Queiroz , Carlos Calaza , José Moreira , Rosana A. Dias , Filipe S. Alves
{"title":"Microfabrication of double proof-mass SOI-based matryoshka-like structures for 3-axis MEMS accelerometers","authors":"Inês S. Garcia ,&nbsp;José Fernandes ,&nbsp;José B. Queiroz ,&nbsp;Carlos Calaza ,&nbsp;José Moreira ,&nbsp;Rosana A. Dias ,&nbsp;Filipe S. Alves","doi":"10.1016/j.mne.2023.100204","DOIUrl":null,"url":null,"abstract":"<div><p>This work presents a micromachining process that allows the creation of hierarchical, matryoshka-like MEMS structures that can be used for multi-axis sensing. This novel vibration multi-axis MEMS sensor based on the capacitive open-loop operation can be widely deployed in the structural monitoring systems due to its simple fabrication and operating principle. The device is composed by a double proof-mass hierarchical design with separate sets of electrodes for in-plane differential measurements. The operation principle of this multi-axis device relies on the fact that accelerations in the zz direction will induce a change in the overlapping area of the xx and yy sensing electrodes, extracted from the single-ended capacitance measurement, while xx and yy accelerations will yield a differential capacitance change. To sense the direction of zz accelerations (capacitance decrease independently of the direction), out-of-plane parallel-plates were added to the device using suspended metallic membranes. The devices were fabricated through an in-house process using a seven-mask dicing-free MEMS process on a 10 μm-thick SOI wafer. The proposed devices were successfully validated using a two-degrees of freedom (DoF) setup that induces external accelerations in the three-orthogonal axes and reads the resulting output voltage of the device. It then possible to conclude that using the proposed fabrication process, it is possible to successfully produce functional multi-structure SOI-based devices that integrate suspended metallic membranes.</p></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"19 ","pages":"Article 100204"},"PeriodicalIF":2.8000,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Micro and Nano Engineering","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2590007223000345","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

This work presents a micromachining process that allows the creation of hierarchical, matryoshka-like MEMS structures that can be used for multi-axis sensing. This novel vibration multi-axis MEMS sensor based on the capacitive open-loop operation can be widely deployed in the structural monitoring systems due to its simple fabrication and operating principle. The device is composed by a double proof-mass hierarchical design with separate sets of electrodes for in-plane differential measurements. The operation principle of this multi-axis device relies on the fact that accelerations in the zz direction will induce a change in the overlapping area of the xx and yy sensing electrodes, extracted from the single-ended capacitance measurement, while xx and yy accelerations will yield a differential capacitance change. To sense the direction of zz accelerations (capacitance decrease independently of the direction), out-of-plane parallel-plates were added to the device using suspended metallic membranes. The devices were fabricated through an in-house process using a seven-mask dicing-free MEMS process on a 10 μm-thick SOI wafer. The proposed devices were successfully validated using a two-degrees of freedom (DoF) setup that induces external accelerations in the three-orthogonal axes and reads the resulting output voltage of the device. It then possible to conclude that using the proposed fabrication process, it is possible to successfully produce functional multi-structure SOI-based devices that integrate suspended metallic membranes.

Abstract Image

三轴MEMS加速度计双证明质量soi类套表结构的微加工
这项工作提出了一种微机械加工工艺,该工艺允许创建可用于多轴传感的分层、类matryoshka MEMS结构。这种基于电容开环操作的新型振动多轴MEMS传感器由于其简单的制造和工作原理,可以广泛应用于结构监测系统中。该设备由双验证质量分级设计组成,具有用于平面内差分测量的独立电极组。该多轴装置的工作原理依赖于这样一个事实,即zz方向上的加速度将引起从单端电容测量中提取的xx和yy感测电极的重叠区域的变化,而xx和yi加速度将产生差分电容变化。为了感测zz加速度的方向(电容与方向无关地减小),使用悬浮金属膜将平面外平行板添加到设备中。这些器件是通过内部工艺在10μm厚的SOI晶片上使用七掩模无划片MEMS工艺制造的。使用两自由度(DoF)设置成功验证了所提出的器件,该设置在三个正交轴上感应外部加速度并读取器件的输出电压。然后可以得出结论,使用所提出的制造工艺,可以成功生产集成悬浮金属膜的功能性多结构SOI基器件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
Micro and Nano Engineering
Micro and Nano Engineering Engineering-Electrical and Electronic Engineering
CiteScore
3.30
自引率
0.00%
发文量
67
审稿时长
80 days
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信