Improving the electromagnetic compatibility of electronic products by using response surface methodology and artificial neural network

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
Ching-Hsiang Chen, Chien-Yi Huang, Yan-Ci Huang
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引用次数: 1

Abstract

Purpose The purpose of this study is to use the Taguchi Method for parametric design in the early stages of product development. electromagnetic compatibility (EMC) issues can be considered in the early stages of product design to reduce counter-measure components, product cost and labor consumption increases due to a number of design changes in the R&D cycle and to accelerate the R&D process. Design/methodology/approach The three EMC characteristics, including radiated emission, conducted emission and fast transient impulse immunity of power, are considered response values; control factors are determined with respect to the relevant parameters for printed circuit board and mechanical design of the product and peripheral devices used in conjunction with the product are considered as noise factors. The optimal parameter set is determined by using the principal component gray relational analysis in conjunction with both response surface methodology and artificial neural network. Findings Market specifications and cost of components are considered to propose an optimal parameter design set with the number of grounded screw holes being 14, the size of the shell heat dissipation holes being 3 mm and the arrangement angle of shell heat dissipation holes being 45 degrees, to dispose of 390 O filters on the noise source. Originality/value The optimal parameter set can improve EMC effectively to accommodate the design specifications required by customers and pass test regulations.
利用响应面法和人工神经网络提高电子产品的电磁兼容性
目的本研究的目的是在产品开发的早期阶段使用田口方法进行参数化设计。电磁兼容性(EMC)问题可以在产品设计的早期阶段考虑,以减少在研发周期中由于多次设计变更而增加的对策元件、产品成本和人工消耗,加快研发进程。考虑了电源的辐射发射、传导发射和快速瞬态冲击抗扰度三个电磁兼容特性的响应值;控制因素是根据印刷电路板和产品的机械设计的相关参数确定的,与产品一起使用的外围设备被认为是噪声因素。采用响应面法和人工神经网络相结合的主成分灰色关联分析方法确定了最优参数集。考虑元器件的市场规格和成本,提出了接地螺孔数为14个,外壳散热孔尺寸为3mm,外壳散热孔布置角度为45度的最优参数设计方案,在噪声源上配置390个O型滤波器。最优的参数设置可以有效地提高EMC,以适应客户要求的设计规范,并通过测试法规。
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来源期刊
Microelectronics International
Microelectronics International 工程技术-材料科学:综合
CiteScore
1.90
自引率
9.10%
发文量
28
审稿时长
>12 weeks
期刊介绍: Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.
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