A chopper amplifier with a pseudo MOS resistor-based tunable bandwidth for EEG applications

IF 0.7 4区工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics International Pub Date : 2023-03-23 DOI:10.1108/mi-06-2022-0106

Amrita Sajja, S. Rooban

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引用次数: 0

Abstract

Purpose The purpose of chopper amplifier is to provide the wideband frequency to support biomedical signals. Design/methodology/approach This paper proposes a chopper-stabilized amplifier with a cascoded operational transconductance amplifier. The high impedance loop is established using an MOS pseudo resistor and with a tunable MOS capacitor. Findings The total power consumption is 451 nW with a supplied voltage of 800 mV. The Gain and common mode rejection ratio are 48 dB and 78 dB, respectively. Research limitations/implications All kinds of real time data analysis was not carried out, only few test samples related to EEG signals are validated because the real time chip was not manufactured due to funding issues. Practical implications The proposed work was validated with Monte-Carlo simulations. There is no external funding for the proposed work. So there is no fabrication for the design. But post simulations are performed. Originality/value The high impedance loop is established using an MOS pseudo resistor and with a tunable MOS capacitor. To the best of the author’s knowledge, this concept is completely novel and there are no publications on this work. All the modules designed for chopper amplifier are new concepts.

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一种用于脑电应用的基于伪MOS电阻的可调谐带宽斩波放大器

目的斩波放大器的目的是提供支持生物医学信号的宽带频率。设计/方法/方法本文提出了一种带级联编码跨导运算放大器的斩波稳定放大器。采用MOS伪电阻和可调谐MOS电容建立高阻抗环路。总功耗为451 nW，供电电压为800 mV。增益和共模抑制比分别为48 dB和78 dB。由于资金问题，实时芯片没有生产，因此没有进行各种实时数据分析，只有少量与EEG信号相关的测试样本得到验证。实际意义通过蒙特卡罗模拟验证了所提出的工作。拟议的工作没有外部资金。所以没有人为设计。但是进行了后期模拟。高阻抗回路是用一个MOS伪电阻和一个可调谐的MOS电容建立的。据作者所知，这个概念是完全新颖的，没有关于这项工作的出版物。斩波放大器所设计的模块都是新概念。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Microelectronics International 工程技术-材料科学：综合

CiteScore

1.90

自引率

9.10%

发文量

审稿时长

>12 weeks

期刊介绍： Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.