Design and implementation of miniaturized tri-band microwave bandpass filter

IF 0.7 4区工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics International Pub Date : 2022-05-10 DOI:10.1108/mi-12-2021-0119

P. P., M. J.

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引用次数: 0

Abstract

Purpose This paper is aimed to study the design of a miniaturized filter with tri-band characteristics. In this paper, perturbation is used to realize circuit miniaturization and multi-band by exploiting the inductive property. During this process, vias are added for twofold benefit, namely, circuit miniaturization and enhanced frequency selectivity at high frequency. Thus, with the introduction of the shorting via, the single-band dual-mode bandpass filter is converted into a tri-band filter with a smaller electrical size. Design/methodology/approach This paper presents the design and characterization of a miniaturized two-port filter with tri-band operating characteristics. The proposed filter is constructed using a square patch resonator operating at 5.2 GHz with a capacitively coupled feed configuration. A square perturbation is added to the corner of the square patch to achieve diagonal symmetry and to excite dual mode. The perturbation offers a sharp transmission zero defining bandwidth of the proposed filter. In addition, a shorting post is introduced to achieve an 88% size reduction by lowering the operating frequency to 1.8 GHz. Findings The prototype filter has insertion less than 1.2 dB and return loss better than 12 dB throughout all the realized frequency bands. The prototype filter is fabricated and the simulation results are validated using experimental measurements. The realized fractional bandwidths of the proposed bandpass filter are 11/5.6/1 at 1.8/4.6/5.85 GHz, respectively. The quality factor of the proposed antenna is greater than 80 and a peak Q-factor of 387 is realized at 5.85 GHz. The high Q-factor indicates low loss and improved selectivity. The rejection levels in the stopband are greater than 20 dB. Originality/value The results indicate that the proposed filter is a suitable choice for low-power small-scale wireless systems operating in the microwave bands. The realized filter has the smallest footprint of 0.36λeff × 0.19λeff where λeff is the effective wavelength calculated at the lowest frequency of operation.

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小型化三波段微波带通滤波器的设计与实现

目的本文旨在研究一种具有三频特性的小型滤波器的设计。本文利用微扰的电感特性，实现了电路的小型化和多频带化。在这个过程中，增加过孔有两个好处，即电路小型化和在高频下增强的频率选择性。因此，通过引入短路过孔，单带双模带通滤波器被转换为具有较小电气尺寸的三带滤波器。设计/方法/方法本文介绍了一种具有三频工作特性的小型化双端口滤波器的设计和表征。所提出的滤波器是使用在5.2下工作的方形贴片谐振器构建的 GHz，具有电容耦合馈电配置。在正方形贴片的角部添加正方形扰动，以实现对角对称并激发双模。扰动提供了定义所提出滤波器带宽的尖锐传输零点。此外，引入了一个短路柱，通过将工作频率降低到1.8来实现88%的尺寸减小 GHz.Findings原型过滤器的插入量小于1.2 dB，回波损耗优于12 dB。制作了原型滤波器，并通过实验测量验证了仿真结果。所提出的带通滤波器在1.8/4.6/5.85时实现的分数带宽为11/5.6/1 GHz。所提出的天线的质量因子大于80，并且在5.85处实现387的峰值Q因子 GHz。高Q因子表示低损耗和改进的选择性。阻带中的抑制水平大于20 dB.原始性/值结果表明，所提出的滤波器是工作在微波波段的低功率小规模无线系统的合适选择。实现的滤波器具有0.36λeff的最小占地面积 × 0.19λeff，其中λeff是在最低工作频率下计算的有效波长。

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来源期刊

Microelectronics International 工程技术-材料科学：综合

CiteScore

1.90

自引率

9.10%

发文量

审稿时长

>12 weeks

期刊介绍： Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.