Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition

IF 1.7 4区材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Soldering & Surface Mount Technology Pub Date : 2020-06-30 DOI:10.1108/ssmt-11-2019-0035

N. Ismail, A. Jalar, M. A. Bakar, N. Safee, W. Yusoff, Ariffin Ismail

{"title":"Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition","authors":"N. Ismail, A. Jalar, M. A. Bakar, N. Safee, W. Yusoff, Ariffin Ismail","doi":"10.1108/ssmt-11-2019-0035","DOIUrl":null,"url":null,"abstract":"\nPurpose\nThe purpose of this paper is to investigate the effect of carbon nanotube (CNT) addition on microstructure, interfacial intermetallic compound (IMC) layer and micromechanical properties of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint under blast wave condition. This work is an extension from the previous study of microstructural evolution and hardness properties of Sn-Ag-Cu (SAC) solder under blast wave condition.\n\n\nDesign/methodology/approach\nSAC/CNT solder pastes were manufactured by mixing of SAC solder powder, fluxes and CNT with 0.02 and 0.04 by weight percentage (Wt.%) separately. This solder paste then printed on the printed circuit board (PCB) with the copper surface finish. Printed samples underwent reflow soldering to form the solder joint. Soldered samples then exposed to the open field air blast test with different weight charges of explosives. Microstructure, interfacial IMC layer and micromechanical behavior of SAC/CNT solder joints after blast test were observed and analyzed via optical microscope, field emission scanning microscope and nanoindentation.\n\n\nFindings\nExposure to the blast wave induced the microstructure instability of SAC305/Cu and SAC/CNT/Cu solder joint. Interfacial IMC layer thickness and hardness properties increases with increase in explosive weight. The existence of CNT in the SAC305 solder system is increasing the resistance of solder joint to the blast wave.\n\n\nOriginality/value\nResponse of micromechanical properties of SAC305/CNT/Cu solder joint has been identified and provided a fundamental understanding of reliability solder joint, especially in extreme conditions such as for military applications.\n","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":" ","pages":""},"PeriodicalIF":1.7000,"publicationDate":"2020-06-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1108/ssmt-11-2019-0035","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Soldering & Surface Mount Technology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1108/ssmt-11-2019-0035","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 10

Abstract

Purpose The purpose of this paper is to investigate the effect of carbon nanotube (CNT) addition on microstructure, interfacial intermetallic compound (IMC) layer and micromechanical properties of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint under blast wave condition. This work is an extension from the previous study of microstructural evolution and hardness properties of Sn-Ag-Cu (SAC) solder under blast wave condition. Design/methodology/approach SAC/CNT solder pastes were manufactured by mixing of SAC solder powder, fluxes and CNT with 0.02 and 0.04 by weight percentage (Wt.%) separately. This solder paste then printed on the printed circuit board (PCB) with the copper surface finish. Printed samples underwent reflow soldering to form the solder joint. Soldered samples then exposed to the open field air blast test with different weight charges of explosives. Microstructure, interfacial IMC layer and micromechanical behavior of SAC/CNT solder joints after blast test were observed and analyzed via optical microscope, field emission scanning microscope and nanoindentation. Findings Exposure to the blast wave induced the microstructure instability of SAC305/Cu and SAC/CNT/Cu solder joint. Interfacial IMC layer thickness and hardness properties increases with increase in explosive weight. The existence of CNT in the SAC305 solder system is increasing the resistance of solder joint to the blast wave. Originality/value Response of micromechanical properties of SAC305/CNT/Cu solder joint has been identified and provided a fundamental understanding of reliability solder joint, especially in extreme conditions such as for military applications.

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冲击波条件下SAC305/CNT/CU焊点的微观结构演变及微观力学性能

目的研究碳纳米管（CNT）的加入对冲击波条件下Sn-3.0Ag-0.5Cu（SAC305）/CNT/Cu焊点的微观结构、界面金属间化合物（IMC）层和微观力学性能的影响。这项工作是对先前研究Sn-Ag-Cu（SAC）焊料在冲击波条件下的微观结构演变和硬度性能的扩展。设计/方法/方法SAC/CNT焊膏通过将SAC焊料粉末、焊剂和CNT分别与0.02和0.04重量百分比（Wt.%）混合来制造。然后将这种焊膏印刷在具有铜表面光洁度的印刷电路板（PCB）上。印刷样品经过回流焊接以形成焊点。然后将焊接样品暴露于具有不同重量炸药装药的露天空气爆破试验中。通过光学显微镜、场发射扫描显微镜和纳米压痕等手段，对SAC/CNT焊点的微观结构、界面IMC层和冲击试验后的微观力学行为进行了观察和分析。发现爆炸波作用下SAC305/Cu和SAC/CNT/Cu焊点的微观结构不稳定。界面IMC层厚度和硬度特性随着炸药重量的增加而增加。SAC305焊接系统中CNT的存在增加了焊点对冲击波的抵抗力。SAC305/CNT/Cu焊点微观力学性能的独创性/价值响应已经确定，并为焊点的可靠性提供了基本的理解，特别是在极端条件下，如军事应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Soldering & Surface Mount Technology 工程技术-材料科学：综合

CiteScore

4.10

自引率

15.00%

发文量

审稿时长

>12 weeks

期刊介绍： Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.