Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow

IF 0.7 4区工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics International Pub Date : 2021-11-16 DOI:10.1108/mi-07-2021-0058

K. Posobkiewicz, K. Górecki

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引用次数: 1

Abstract

Purpose The purpose of this study is to investigate the validation of the usefulness of cooling systems containing Peltier modules for cooling power devices based on measurements of the influence of selected factors on the value of thermal resistance of such a cooling system. Design/methodology/approach A cooling system containing a heat-sink, a Peltier module and a fan was built by the authors and the measurements of temperatures and thermal resistance in various supply conditions of the Peltier module and the fan were carried out and discussed. Findings Conclusions from the research carried out answer the question if the use of Peltier modules in active cooling systems provides any benefits comparing with cooling systems containing just passive heat-sinks or conventional active heat-sinks constructed of a heat-sink and a fan. Research limitations/implications The research carried out is the preliminary stage to asses if a compact thermal model of the investigated cooling system can be formulated. Originality/value In the paper, the original results of measurements and calculations of parameters of a cooling system containing a Peltier module and an active heat-sink are presented and discussed. An influence of power dissipated in the components of the cooling system on its efficiency is investigated.

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选定因素对带珀尔帖模块和强制气流的冷却系统参数的影响

目的本研究的目的是在测量选定因素对冷却系统热阻值的影响的基础上，研究包含Peltier模块的冷却系统对冷却功率设备的有用性的验证。设计/方法/方法作者建造了一个包含散热器、珀耳帖模块和风扇的冷却系统，并对珀耳帖组件和风扇在各种供应条件下的温度和热阻进行了测量和讨论。研究结果：与仅包含被动散热器或由散热器和风扇构成的传统主动散热器的冷却系统相比，在主动冷却系统中使用珀耳帖模块是否有任何好处。研究局限性/含义所进行的研究是评估是否可以制定所研究冷却系统的紧凑热模型的初步阶段。独创性/价值本文介绍并讨论了包含珀耳帖模块和有源散热器的冷却系统参数的原始测量和计算结果。研究了冷却系统各部件的功率耗散对其效率的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Microelectronics International 工程技术-材料科学：综合

CiteScore

1.90

自引率

9.10%

发文量

审稿时长

>12 weeks

期刊介绍： Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.