Design criteria for pad and stencil with high pick-and-Place yield

IF 1.7 4区材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Soldering & Surface Mount Technology Pub Date : 2021-10-14 DOI:10.1108/ssmt-06-2021-0037

Chien-Yi Huang, Christopher Greene, Chao-Chieh Chan, Pingshan Wang

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引用次数: 0

Abstract

Purpose This study aims to focus on the passive components of System in Package SiP modules and discusses the geometric pad designs for 01005-sized passive components, the front end design of the hole size and shape of the stencil and the parameters of the stencil sidewall coating, to determine the optimum parameter combination. Design/methodology/approach This study plans and conducts experiments, where a L8(27) inner orthogonal array is built to consider the control factors, including a L4(23) outer orthogonal array to consider the noise factor, and the experimental data are analyzed by using the technique for order preference by similarity to ideal solution multi-quality analysis method. Findings The results show that the optimum design parameter level combination is that the solder mask opening pad has no solder mask in the lower part of the component, the pad width is 1.1 times that of the component width, the pad length is 1.75 times that of the electrode tip length, the pad spacing is 5 mil, the stencil open area is 90% of the pad area, the stencil opening corner has a 3 mil chamfer angle, and the stencil sidewall is free of nano-coating. Originality/value The parameter design and multi-quality analysis method, as proposed in this study, can effectively develop the layout of passive components on a high-density SiP module substrate, to stabilize the process and increase the production yield.

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具有高拾取和放置成品率的衬垫和模板的设计标准

本研究以System in Package SiP模块的无源器件为研究对象，对01005尺寸无源器件的几何衬垫设计、前端模板孔尺寸和形状的设计以及模板侧壁涂层的参数进行了探讨，确定了最优的参数组合。设计/方法学/方法本研究计划并进行实验，构建L8(27)内正交阵列考虑控制因素，构建L4(23)外正交阵列考虑噪声因素，采用与理想解多质量分析法相似度排序偏好技术对实验数据进行分析。FindingsThe结果表明,优化设计参数水平组合焊接掩模口垫没有焊接掩模的下部组件,组件的垫宽度是1.1倍,宽度,垫的长度是1.75倍的电极头长度、板间距5毫升,打开模板面积板面积的90%,模板打开角落里有3 mil倒角和nano-coating模板侧壁是免费的。本研究提出的参数设计和多质量分析方法，可以有效地开发高密度SiP模块基板上无源元件的布局，稳定工艺，提高产量。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Soldering & Surface Mount Technology 工程技术-材料科学：综合

CiteScore

4.10

自引率

15.00%

发文量

审稿时长

>12 weeks

期刊介绍： Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.