Effects of interface cracks on reliability of surface mount technology interconnection in service environment

IF 0.7 4区工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics International Pub Date : 2023-01-12 DOI:10.1108/mi-10-2022-0183

S. Liu, Songjie Yao, Song Xue, Benben Wang, Hui Jin, C. Pan, Yinwei Zhang, Yijiang Zhou, Rui Zeng, Lihao Ping, Z. Min, Daxing Zhang, Congsi Wang

{"title":"Effects of interface cracks on reliability of surface mount technology interconnection in service environment","authors":"S. Liu, Songjie Yao, Song Xue, Benben Wang, Hui Jin, C. Pan, Yinwei Zhang, Yijiang Zhou, Rui Zeng, Lihao Ping, Z. Min, Daxing Zhang, Congsi Wang","doi":"10.1108/mi-10-2022-0183","DOIUrl":null,"url":null,"abstract":"\nPurpose\nSurface mount technology (SMT) is widely used and plays an important role in electronic equipment. The purpose of this paper is to reveal the effects of interface cracks on the fatigue life of SMT solder joint under service load and to provide some valuable reference information for improving service reliability of SMT packages.\n\n\nDesign/methodology/approach\nA 3D geometric model of SMT package is established. The mechanical properties of SMT solder joint under thermal cycling load and random vibration load were solved by 3D finite element analysis. The fatigue life of SMT solder joint under different loads can be calculated by using the modified Coffin–Manson model and high-cycle fatigue model.\n\n\nFindings\nThe results revealed that cracks at different locations and propagation directions have different effect on the fatigue life of the SMT solder joint. From the location of the cracks, Crack 1 has the most significant impact on the thermal fatigue life of the solder joint. Under the same thermal cycling conditions, its life has decreased by 46.98%, followed by Crack 2, Crack 4 and Crack 3. On the other hand, under the same random vibration load, Crack 4 has the most significant impact on the solder joint fatigue life, reducing its life by 81.39%, followed by Crack 1, Crack 3 and Crack 2. From the crack propagation direction, with the increase of crack depth, the thermal fatigue life of the SMT solder joint decreases sharply at first and then continues to decline almost linearly. The random vibration fatigue life of the solder joint decreases continuously with the increase of crack depth. From the crack depth of 0.01 mm to 0.05 mm, the random vibration fatigue life decreases by 86.75%. When the crack width increases, the thermal and random vibration fatigue life of the solder joint decreases almost linearly.\n\n\nOriginality/value\nThis paper investigates the effects of interface cracks on the fatigue life and provides useful information on the reliability of SMT packages.\n","PeriodicalId":49817,"journal":{"name":"Microelectronics International","volume":" ","pages":""},"PeriodicalIF":0.7000,"publicationDate":"2023-01-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics International","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1108/mi-10-2022-0183","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 2

Abstract

Purpose Surface mount technology (SMT) is widely used and plays an important role in electronic equipment. The purpose of this paper is to reveal the effects of interface cracks on the fatigue life of SMT solder joint under service load and to provide some valuable reference information for improving service reliability of SMT packages. Design/methodology/approach A 3D geometric model of SMT package is established. The mechanical properties of SMT solder joint under thermal cycling load and random vibration load were solved by 3D finite element analysis. The fatigue life of SMT solder joint under different loads can be calculated by using the modified Coffin–Manson model and high-cycle fatigue model. Findings The results revealed that cracks at different locations and propagation directions have different effect on the fatigue life of the SMT solder joint. From the location of the cracks, Crack 1 has the most significant impact on the thermal fatigue life of the solder joint. Under the same thermal cycling conditions, its life has decreased by 46.98%, followed by Crack 2, Crack 4 and Crack 3. On the other hand, under the same random vibration load, Crack 4 has the most significant impact on the solder joint fatigue life, reducing its life by 81.39%, followed by Crack 1, Crack 3 and Crack 2. From the crack propagation direction, with the increase of crack depth, the thermal fatigue life of the SMT solder joint decreases sharply at first and then continues to decline almost linearly. The random vibration fatigue life of the solder joint decreases continuously with the increase of crack depth. From the crack depth of 0.01 mm to 0.05 mm, the random vibration fatigue life decreases by 86.75%. When the crack width increases, the thermal and random vibration fatigue life of the solder joint decreases almost linearly. Originality/value This paper investigates the effects of interface cracks on the fatigue life and provides useful information on the reliability of SMT packages.

查看原文本刊更多论文

服务环境下界面裂纹对表面安装技术互连可靠性的影响

表面贴装技术（SMT）在电子设备中应用广泛，发挥着重要作用。本文旨在揭示界面裂纹对SMT焊点在使用载荷下疲劳寿命的影响，为提高SMT封装的使用可靠性提供一些有价值的参考信息。设计/方法论/方法建立了SMT封装的三维几何模型。通过三维有限元分析，求解了SMT焊点在热循环载荷和随机振动载荷作用下的力学性能。使用改进的Coffin–Manson模型和高周疲劳模型可以计算SMT焊点在不同载荷下的疲劳寿命。结果表明，不同位置和扩展方向的裂纹对SMT焊点的疲劳寿命有不同的影响。从裂纹的位置来看，裂纹1对焊点的热疲劳寿命影响最大。在相同的热循环条件下，其寿命下降了46.98%，其次是裂纹2、裂纹4和裂纹3。另一方面，在相同的随机振动载荷下，裂纹4对焊点疲劳寿命的影响最为显著，其寿命降低了81.39%，其次是裂纹1、裂纹3和裂纹2。从裂纹扩展方向来看，随着裂纹深度的增加，SMT焊点的热疲劳寿命先急剧下降，然后几乎线性地继续下降。焊点的随机振动疲劳寿命随着裂纹深度的增加而连续下降。从裂缝深度0.01开始 mm至0.05 mm时，焊点的热疲劳寿命和随机振动疲劳寿命几乎呈线性下降。原创性/价值本文研究了界面裂纹对疲劳寿命的影响，并为SMT封装的可靠性提供了有用的信息。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Microelectronics International 工程技术-材料科学：综合

CiteScore

1.90

自引率

9.10%

发文量

审稿时长

>12 weeks

期刊介绍： Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.