Effect of Intermittent Injection of Ar/CH4 Quenching Gas on Particle Composition and Size of Si/C Nanoparticles Synthesized by Modulated Induction Thermal Plasma

IF 2.5 3区 物理与天体物理 Q3 ENGINEERING, CHEMICAL
Keita Akashi, Yasunori Tanaka, Y. Nakano, R. Furukawa, T. Ishijima, S. Sueyasu, S. Watanabe, K. Nakamura
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引用次数: 6

Abstract

This paper describes effects of intermittent Ar/CH4 quenching gas (QG) injection on the size and composition of Si/C nanoparticles synthesized using pulse-modulated induction thermal plasma (PMITP). Time-controlled feeding of feedstock (TCFF), with synchronous and intermittent injection of silicon feedstock powder to the PMITP, was used for high-rate production of Si nanoparticles. Also, Ar QG was supplied intermittently from the chamber wall to enhance the cooling effect further. The QG also included CH4 as a carbon source gas for Si/C nanoparticle synthesis. Intermittent QG injection timing was studied for the composition of Si/C nanoparticles. The synthesized particles were analysed using FE-SEM, XRD, TEM, EDS, and Raman spectroscopy. Furthermore, numerical thermofluid simulation was also conducted to obtain the time varying temperature distribution in the reaction chamber, considering intermittent QG injection. From this numerical calculation, the dependence of the minimum temperature on the QG injection timing was found. The above experimental and numerical results indicate that carbon-coated Si nanoparticles can be synthesized when QG is injected at appropriate timing into the PMITP with temperatures of 1000–2000 K.

Abstract Image

间歇注入Ar/CH4淬火气体对调制感应热等离子体合成Si/C纳米颗粒组成和尺寸的影响
本文研究了间歇注入Ar/CH4淬火气(QG)对脉冲调制感应热等离子体(PMITP)合成的Si/C纳米颗粒尺寸和组成的影响。采用时间控制进料(TCFF),同步间歇向PMITP注入硅原料粉,实现了硅纳米颗粒的高速率生产。同时,从腔壁上间歇供给氩气,进一步提高了冷却效果。该QG还包括CH4作为碳源气体,用于Si/C纳米颗粒的合成。研究了QG间歇注射时间对Si/C纳米颗粒组成的影响。采用FE-SEM、XRD、TEM、EDS和拉曼光谱对合成颗粒进行了分析。此外,还进行了数值热流体模拟,得到了考虑间歇注射QG的反应室内温度随时间变化的分布。通过数值计算,发现了最低温度与QG喷射时间的关系。上述实验和数值结果表明,在温度为1000 ~ 2000 K的PMITP中,在适当的时间注入QG可以合成碳包覆的Si纳米颗粒。
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来源期刊
Plasma Chemistry and Plasma Processing
Plasma Chemistry and Plasma Processing 工程技术-工程:化工
CiteScore
5.90
自引率
8.30%
发文量
73
审稿时长
6-12 weeks
期刊介绍: Publishing original papers on fundamental and applied research in plasma chemistry and plasma processing, the scope of this journal includes processing plasmas ranging from non-thermal plasmas to thermal plasmas, and fundamental plasma studies as well as studies of specific plasma applications. Such applications include but are not limited to plasma catalysis, environmental processing including treatment of liquids and gases, biological applications of plasmas including plasma medicine and agriculture, surface modification and deposition, powder and nanostructure synthesis, energy applications including plasma combustion and reforming, resource recovery, coupling of plasmas and electrochemistry, and plasma etching. Studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces are also solicited. It is essential that submissions include substantial consideration of the role of the plasma, for example, the relevant plasma chemistry, plasma physics or plasma–surface interactions; manuscripts that consider solely the properties of materials or substances processed using a plasma are not within the journal’s scope.
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