Guest Editorial Special Section on the 2022 SEMI Advanced Semiconductor Manufacturing Conference

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Semiconductor Manufacturing Pub Date : 2023-08-04 DOI:10.1109/TSM.2023.3297059

Jeanne Paulette Bickford;Oliver D. Patterson;Delphine Le Cunff;Ralf Buengener;Stefan Radloff;Paul Werbaneth

引用次数: 0

Abstract

The 2022 ASMC, our 33rd, returned to Saratoga Springs, NY as an in-person conference after 2 years as a virtual conference. While we are all grateful for the digital world’s enhancements that allowed this conference to be held remotely, attendees were happy to return to an in-person event where networking is much easier.

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2022年SEMI先进半导体制造会议特邀编辑专区

2022年ASMC，我们的第33届，在两年的虚拟会议之后，回到了纽约州萨拉托加斯普林斯作为面对面的会议。虽然我们都感谢数字世界的改进，使这次会议能够远程举行，但与会者很高兴回到面对面的会议，因为面对面的会议更容易建立网络。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Semiconductor Manufacturing 工程技术-工程：电子与电气

CiteScore

5.20

自引率

11.10%

发文量

101

审稿时长

3.3 months

期刊介绍： The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.