Weizhong Chen;Huimin Tan;Wei Li;Li Wan;Haifeng Qin;Hongsheng Zhang;Zhengsheng Han
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引用次数: 0
Abstract
A Reverse-Conducting LIGBT integrated with three-mode Self-Adaptive n-channel MOS (SAM), named SAM-LIGBT, is proposed. SAM-LIGBT consists of a control region and a conduction region. The control region is equivalent to two diodes connected in reverse series, with its P+ regions on both sides connected to the Collector and Emitter, respectively. When the Collector or Emitter voltage rises, the potential of the N-drift and buffer regions increases accordingly. The rise in N-drift potential creates an electron accumulation effect on both sides of the conduction region. The rise in buffer potential provides the gate voltage for the SAM. 1) During forward conduction, the SAM turns on, and the electron accumulation effect enhances electron injection efficiency. Meanwhile, the P-base substrate of the SAM acts as an electron barrier, eliminating the snapback phenomenon; 2) During reverse conduction state, the SAM turns on, providing reverse conduction capability; 3) During the turn-off process, the SAM turns on to form an electron extraction channel, accelerating electron removal, thereby shortening the turn-off time $t_{\mathrm {OFF}}$ and reducing the turn-off loss $E_{\mathrm {OFF}}$ . Additionally, the SAM improves the device’s short-circuit safety and reverse recovery capability. In summary, the SAM-LIGBT achieves snapback-free operation and an excellent trade-off between the forward voltage drop $V_{\mathrm {ON}}$ and the turn-off loss $E_{\mathrm {OFF}}$ .
期刊介绍:
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.