SafeHDC: Concurrent Uncertainty and Fault Detection in Hyperdimensional Computing

IF 2.7 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Mahboobe Sadeghipour Roodsari;Vincent Meyers;Mehdi Tahoori
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引用次数: 0

Abstract

HyperDimensional Computing (HDC) is a brain-inspired machine learning paradigm that encodes data into high-dimensional hypervectors and performs classification through similarity comparisons. Its computational efficiency, one-shot learning capability, and robustness to noise make it attractive for resource-constrained edge applications. However, HDC systems can still exhibit uncertainty when inputs deviate from the training distribution, such as with noisy or Out-of-Distribution (OOD) data, and when hardware faults occur within the encoding or classification stages, potentially compromising reliability in safety-critical scenarios. This work introduces SafeHDC, an ultra-lightweight, concurrent runtime mechanism that detects both input-induced uncertainty and hardware-induced anomalies without model retraining or added latency. SafeHDC identifies noisy and OOD inputs as well as internal faults with negligible hardware cost (2 LUTs, 1 register). Experimental results show that SafeHDC achieves competitive detection accuracy and reaches up to 100% fault-detection coverage in many situations, enabling real-time safety enhancement for HDC accelerators with minimal overhead.
超维计算中的并发不确定性和故障检测
HDC (HyperDimensional Computing)是一种受大脑启发的机器学习范式,它将数据编码为高维超向量,并通过相似性比较进行分类。它的计算效率、一次性学习能力和对噪声的鲁棒性使其对资源受限的边缘应用具有吸引力。然而,当输入偏离训练分布时,HDC系统仍然会表现出不确定性,例如有噪声或偏离分布(OOD)数据,以及当编码或分类阶段发生硬件故障时,可能会影响安全关键场景的可靠性。这项工作引入了SafeHDC,这是一种超轻量级的并发运行时机制,可以检测输入引起的不确定性和硬件引起的异常,而无需重新训练模型或增加延迟。SafeHDC识别噪声和OOD输入以及内部故障,硬件成本可忽略不计(2个lut, 1个寄存器)。实验结果表明,在许多情况下,SafeHDC的检测精度具有竞争力,故障检测覆盖率高达100%,以最小的开销实现了HDC加速器的实时安全性增强。
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来源期刊
IEEE Transactions on Device and Materials Reliability
IEEE Transactions on Device and Materials Reliability 工程技术-工程:电子与电气
CiteScore
4.80
自引率
5.00%
发文量
71
审稿时长
6-12 weeks
期刊介绍: The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.
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