{"title":"A Low-Dark-Current 4H-SiC MOS UV Photodetector With a Charge-Trapping Gate Stack by Electric Field Modulation Operation","authors":"Yao-Cheng Yang;Jenn-Gwo Hwu","doi":"10.1109/LED.2026.3721489","DOIUrl":null,"url":null,"abstract":"A 4H-SiC metal–oxide–semiconductor ultraviolet photodetector featuring an Al<sub>2</sub>O<sub>3</sub>/AlO<inline-formula> <tex-math>${}_{x}$ </tex-math></inline-formula>/SiO<sub>2</sub> charge-trapping gate stack is demonstrated for highly sensitive ultraviolet intensity monitoring. A high-quality SiO<sub>2</sub>/SiC interface formed by intermittent spray hydrated oxidation suppresses interface defects, resulting in an ultralow dark current density (<inline-formula> <tex-math>${3}.{96} \\times {10}^{-{10}}~\\text {A}/ {cm}^{{2}}$ </tex-math></inline-formula>) under a reverse bias of -5 V. Subsequently, the upper gate dielectric layers are fabricated using thermal evaporation followed by a multi-step anodic oxidation process. Under ultraviolet illumination, photogenerated holes tunnel through the ultrathin SiO<sub>2</sub> layer and are stored in the oxygen-deficient AlO<inline-formula> <tex-math>${}_{x}$ </tex-math></inline-formula> layer, where the accumulated positive charges redistribute the internal oxide electric field. The continuously increasing oxide field drives a carrier transport transition from Poole–Frenkel emission to Fowler–Nordheim tunneling. The device achieves a photo-to-dark current ratio of <inline-formula> <tex-math>${8}.{0} \\times {10}^{{4}}$ </tex-math></inline-formula> at an ultraviolet power density of 400 W/m<sup>2</sup> and exhibits excellent linearity with a coefficient of determination (R<sup>2</sup>) exceeding 0.997. These results demonstrate a highly promising electric-field-modulation approach for robust charge-trapping-assisted ultraviolet sensing and precision intensity monitoring applications.","PeriodicalId":13198,"journal":{"name":"IEEE Electron Device Letters","volume":"47 10","pages":"2095-2098"},"PeriodicalIF":4.6000,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electron Device Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11644713/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2026/8/7 0:00:00","PubModel":"Epub","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
A 4H-SiC metal–oxide–semiconductor ultraviolet photodetector featuring an Al2O3/AlO${}_{x}$ /SiO2 charge-trapping gate stack is demonstrated for highly sensitive ultraviolet intensity monitoring. A high-quality SiO2/SiC interface formed by intermittent spray hydrated oxidation suppresses interface defects, resulting in an ultralow dark current density (${3}.{96} \times {10}^{-{10}}~\text {A}/ {cm}^{{2}}$ ) under a reverse bias of -5 V. Subsequently, the upper gate dielectric layers are fabricated using thermal evaporation followed by a multi-step anodic oxidation process. Under ultraviolet illumination, photogenerated holes tunnel through the ultrathin SiO2 layer and are stored in the oxygen-deficient AlO${}_{x}$ layer, where the accumulated positive charges redistribute the internal oxide electric field. The continuously increasing oxide field drives a carrier transport transition from Poole–Frenkel emission to Fowler–Nordheim tunneling. The device achieves a photo-to-dark current ratio of ${8}.{0} \times {10}^{{4}}$ at an ultraviolet power density of 400 W/m2 and exhibits excellent linearity with a coefficient of determination (R2) exceeding 0.997. These results demonstrate a highly promising electric-field-modulation approach for robust charge-trapping-assisted ultraviolet sensing and precision intensity monitoring applications.
期刊介绍:
IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.