{"title":"Normally-Off β-Ga2O3 Trench-Gate Current-Aperture Vertical Electron Transistors With High-Voltage Drain--Stress Stability","authors":"Jiahao Yao;Hehe Gong;Gaofu Guo;Jiazhao Jia;Anjing Luo;Zineng Yang;Rongming Yin;Fang-Fang Ren;Shulin Gu;Xiaodong Zhang;Yuhao Zhang;Jiandong Ye","doi":"10.1109/LED.2026.3728000","DOIUrl":null,"url":null,"abstract":"Enhancement-mode (E-mode) <inline-formula> <tex-math>$\\beta $ </tex-math></inline-formula>-Ga<sub>2</sub>O<sub>3</sub> transistors are highly desired for kV-class power switching, but their realization remains challenging due to the lack of effective p-type doping. Fin- and trench-gate structures have been employed to achieve the E-mode operation, but they suffer gate-corner electric-field (E-field) crowding and thereby reliability concerns. Here we propose the deployment of the current aperture vertical electron transistor (CAVET) architecture to shield the trench-gate from high E-field. The fabricated trench-gate CAVET achieves a threshold voltage of 2.1 V, a small transfer hysteresis of 50 mV, a specific on-resistance of 13.4 m<inline-formula> <tex-math>$\\Omega \\cdot $ </tex-math></inline-formula>cm<sup>2</sup>, and a breakdown voltage of 1140 V. Its stability is investigated under high-bias drain stress, presenting small parametric shifts after 600 V stress for 1000 s. When elevating the stress bias to 1000 V, the device presents no gate failure, validating the effective E-field shielding. Notably, such high-bias stability tests have not been previously reported for Ga<sub>2</sub>O<sub>3</sub> vertical transistors. Therefore, this work demonstrates a promising architecture for normally-off, kV-class <inline-formula> <tex-math>$\\beta $ </tex-math></inline-formula>-Ga<sub>2</sub>O<sub>3</sub> power transistors with high-voltage drain-stress stability.","PeriodicalId":13198,"journal":{"name":"IEEE Electron Device Letters","volume":"47 10","pages":"2091-2094"},"PeriodicalIF":4.6000,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electron Device Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11676054/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2026/9/2 0:00:00","PubModel":"Epub","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Enhancement-mode (E-mode) $\beta $ -Ga2O3 transistors are highly desired for kV-class power switching, but their realization remains challenging due to the lack of effective p-type doping. Fin- and trench-gate structures have been employed to achieve the E-mode operation, but they suffer gate-corner electric-field (E-field) crowding and thereby reliability concerns. Here we propose the deployment of the current aperture vertical electron transistor (CAVET) architecture to shield the trench-gate from high E-field. The fabricated trench-gate CAVET achieves a threshold voltage of 2.1 V, a small transfer hysteresis of 50 mV, a specific on-resistance of 13.4 m$\Omega \cdot $ cm2, and a breakdown voltage of 1140 V. Its stability is investigated under high-bias drain stress, presenting small parametric shifts after 600 V stress for 1000 s. When elevating the stress bias to 1000 V, the device presents no gate failure, validating the effective E-field shielding. Notably, such high-bias stability tests have not been previously reported for Ga2O3 vertical transistors. Therefore, this work demonstrates a promising architecture for normally-off, kV-class $\beta $ -Ga2O3 power transistors with high-voltage drain-stress stability.
期刊介绍:
IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.