High-Performance S/D-First IGZO TFTs Integrated With p-Type Si Nanowire FETs for Complementary Logic

IF 4.6 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Electron Device Letters Pub Date : 2026-10-01 Epub Date: 2026-08-24 DOI:10.1109/LED.2026.3725781
Le Weng;Wentao Qian;Shuo Zhang;Zhinong Yu;Junzhuan Wang;Linwei Yu
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引用次数: 0

Abstract

High-performance complementary logic requires process-compatible n-type and p-type devices with low degradation. Here, we report the heterogeneous integration of source/drain-first (S/D-first) IGZO TFTs with in-plane solid–liquid–solid (IPSLS)-grown p-type Si nanowire (SiNW) FETs for complementary logic. The S/D-first process effectively suppresses lithography-induced channel damage, thereby enabling that the field-effect mobility of IGZO TFT increases to 31.4 cm2 V-1 s-1, while the subthreshold swing decreases 166 mV dec-1. Meanwhile, the p-SiNW FETs exhibit a field-effect mobility of 54 cm2 V-1 s-1 and a subthreshold swing of ~117 mV dec-1. Based on these complementary devices, low-power inverters as well as NOR, NAND, and AND logic gates are demonstrated, confirming the feasibility of combing the n-IGZO TFTs and p-SiNW FETs for heterogeneous complementary logic integration.
高性能S/D-First IGZO tft与p型Si纳米线场效应管集成,用于互补逻辑
高性能互补逻辑需要工艺兼容的低退化n型和p型器件。在这里,我们报道了源/漏极优先(S/ d优先)IGZO tft与平面内固-液-固(IPSLS)生长的p型硅纳米线(SiNW) fet的异质集成,用于互补逻辑。S/ d优先工艺有效地抑制了光刻引起的通道损伤,从而使IGZO TFT的场效应迁移率增加到31.4 cm2 V-1 S -1,而亚阈值摆幅减少了166 mV dec1。同时,p-SiNW场效应管的场效应迁移率为54 cm2 V-1 s-1,亚阈值摆幅为~117 mV dec1。基于这些互补器件,展示了低功耗逆变器以及NOR、NAND和and逻辑门,证实了将n-IGZO TFTs和p-SiNW fet结合进行异质互补逻辑集成的可行性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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