4-Transistor IGZO Ternary Content Addressable Memory Enabling Large-Scale Array Integration for In-Memory Computing

IF 4.6 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Electron Device Letters Pub Date : 2026-10-01 Epub Date: 2026-08-21 DOI:10.1109/LED.2026.3725692
Taewon Seo;Taejun Ha;Seunghyun Son;Sunmean Kim;Yoonyoung Chung
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引用次数: 0

Abstract

We report a 4-transistor (4T) Ternary Content Addressable Memory (TCAM) that significantly reduces the physical footprint by employing dual-gate IGZO transistors. High-density TCAMs are essential components for memory augmented neural networks and advanced computing systems; however, the large physical footprint remains a significant limitation in conventional designs. The proposed TCAM unit cell adopts a simplified structure, reducing the transistor count to four, which is substantially lower than previous SRAM-based (16T) and oxide semiconductor-based (6T) counterparts. Moreover, connecting the search line directly to the gate electrode effectively mitigates IR drop, enhancing the design’s suitability for large-scale memory applications. Experimental results validate the proposed design, demonstrating accurate Hamming distance computations (155.9 nA/bit), high endurance ( $\gt$ $10^{{10}}$ cycles), and fast operation with 350 ps search latency and 220 ns write time.
4晶体管IGZO三元内容可寻址存储器,实现内存计算的大规模阵列集成
我们报告了一种4晶体管(4T)三元内容可寻址存储器(TCAM),该存储器通过采用双栅IGZO晶体管显着减少了物理占用。高密度tcam是记忆增强神经网络和先进计算系统的重要组成部分;然而,大的物理足迹仍然是传统设计的一个重大限制。提出的TCAM单元电池采用简化的结构,将晶体管数量减少到四个,这大大低于以前基于sram (16T)和基于氧化物半导体(6T)的同类产品。此外,将搜索线直接连接到栅极电极有效地减轻了红外下降,增强了设计对大规模存储应用的适用性。实验结果验证了所提出的设计,证明了精确的汉明距离计算(155.9 nA/bit),高耐用性($\gt$ $10^{{10}}$周期),以及350 ps的搜索延迟和220 ns的写入时间的快速运行。
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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