Junchi Cheng;Quanyi Tu;Renhao Xue;Ruizhan Yan;Wenjuan Zhou;Mansun Chan;Xiwen Liu
{"title":"Monolithic Integration of Hybrid 2T0C DRAM/FeRAM With In-Situ Weight Transfer","authors":"Junchi Cheng;Quanyi Tu;Renhao Xue;Ruizhan Yan;Wenjuan Zhou;Mansun Chan;Xiwen Liu","doi":"10.1109/LED.2026.3718712","DOIUrl":null,"url":null,"abstract":"In this work, we demonstrate a monolithically integrated hybrid memory that stacks 2T0C DRAM on FeRAM and enables in-situ weight transfer within a single cell. Leveraging an MIS stack enabled by the monolithic all-ALD process, the 2T0C DRAM achieves an off-state leakage of <inline-formula> <tex-math>$8.48\\times 10^{-{14}}$ </tex-math></inline-formula> A/<inline-formula> <tex-math>$\\mu $ </tex-math></inline-formula>m, retention >200 s, endurance <inline-formula> <tex-math>$\\gt 10^{{11}}$ </tex-math></inline-formula> cycles, and stress immunity >10000 s. Meanwhile, the all-ALD TiN/HZO/TiN FeRAM exhibits 2P<inline-formula> <tex-math>${}_{\\text {r}} \\gt 50~\\mu $ </tex-math></inline-formula>C/cm<sup>2</sup>, with projected retention >10 years and endurance <inline-formula> <tex-math>$\\gt 10^{{10}}$ </tex-math></inline-formula> cycles. Beyond co-integration, bidirectional in-situ transfer is realized without external circuits. Specifically, the large read window (high I<sub>ON</sub>/I<inline-formula> <tex-math>${}_{\\text {OFF}}\\text {)}$ </tex-math></inline-formula> of the 2T0C DRAM programs its “0”/“1” states into distinct FeRAM polarization states via controlled polarization reversal, while the large displacement current during FeRAM switching is exploited to reload the FeRAM state back into the 2T0C DRAM. This hybrid cell enables in-cell bidirectional volatile–nonvolatile transfer, serving as a compact primitive for hybrid memory hierarchies, compute-in-memory, and energy-efficient AI with rapid updates and persistent storage.","PeriodicalId":13198,"journal":{"name":"IEEE Electron Device Letters","volume":"47 10","pages":"2107-2110"},"PeriodicalIF":4.6000,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electron Device Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11635915/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2026/7/31 0:00:00","PubModel":"Epub","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this work, we demonstrate a monolithically integrated hybrid memory that stacks 2T0C DRAM on FeRAM and enables in-situ weight transfer within a single cell. Leveraging an MIS stack enabled by the monolithic all-ALD process, the 2T0C DRAM achieves an off-state leakage of $8.48\times 10^{-{14}}$ A/$\mu $ m, retention >200 s, endurance $\gt 10^{{11}}$ cycles, and stress immunity >10000 s. Meanwhile, the all-ALD TiN/HZO/TiN FeRAM exhibits 2P${}_{\text {r}} \gt 50~\mu $ C/cm2, with projected retention >10 years and endurance $\gt 10^{{10}}$ cycles. Beyond co-integration, bidirectional in-situ transfer is realized without external circuits. Specifically, the large read window (high ION/I${}_{\text {OFF}}\text {)}$ of the 2T0C DRAM programs its “0”/“1” states into distinct FeRAM polarization states via controlled polarization reversal, while the large displacement current during FeRAM switching is exploited to reload the FeRAM state back into the 2T0C DRAM. This hybrid cell enables in-cell bidirectional volatile–nonvolatile transfer, serving as a compact primitive for hybrid memory hierarchies, compute-in-memory, and energy-efficient AI with rapid updates and persistent storage.
期刊介绍:
IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.