Monolithic Integration of Hybrid 2T0C DRAM/FeRAM With In-Situ Weight Transfer

IF 4.6 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Electron Device Letters Pub Date : 2026-10-01 Epub Date: 2026-07-31 DOI:10.1109/LED.2026.3718712
Junchi Cheng;Quanyi Tu;Renhao Xue;Ruizhan Yan;Wenjuan Zhou;Mansun Chan;Xiwen Liu
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引用次数: 0

Abstract

In this work, we demonstrate a monolithically integrated hybrid memory that stacks 2T0C DRAM on FeRAM and enables in-situ weight transfer within a single cell. Leveraging an MIS stack enabled by the monolithic all-ALD process, the 2T0C DRAM achieves an off-state leakage of $8.48\times 10^{-{14}}$ A/ $\mu $ m, retention >200 s, endurance $\gt 10^{{11}}$ cycles, and stress immunity >10000 s. Meanwhile, the all-ALD TiN/HZO/TiN FeRAM exhibits 2P ${}_{\text {r}} \gt 50~\mu $ C/cm2, with projected retention >10 years and endurance $\gt 10^{{10}}$ cycles. Beyond co-integration, bidirectional in-situ transfer is realized without external circuits. Specifically, the large read window (high ION/I ${}_{\text {OFF}}\text {)}$ of the 2T0C DRAM programs its “0”/“1” states into distinct FeRAM polarization states via controlled polarization reversal, while the large displacement current during FeRAM switching is exploited to reload the FeRAM state back into the 2T0C DRAM. This hybrid cell enables in-cell bidirectional volatile–nonvolatile transfer, serving as a compact primitive for hybrid memory hierarchies, compute-in-memory, and energy-efficient AI with rapid updates and persistent storage.
具有原位重量传递的混合2T0C DRAM/FeRAM的单片集成
在这项工作中,我们展示了一种单片集成混合存储器,它将2T0C DRAM堆叠在FeRAM上,并在单个单元内实现原位重量传递。利用单片全ald工艺支持的MIS堆栈,2T0C DRAM实现了8.48\ × 10^{-{14}}$ A/ $\mu $ m的非状态泄漏,保持>200 s,持久时间$\gt 10^{{11}}$周期,应力免疫>10000 s。同时,全ald TiN/HZO/TiN FeRAM表现为2P ${}_{\text {r}} \gt 50~\mu $ C/cm2,预计保留时间为$ $ 1 10年,寿命为$ $ gt 10^{{10}}$周期。除协整外,无需外部电路即可实现双向原位转移。具体来说,2T0C DRAM的大读窗(高离子/I ${}_{\text {OFF}}}\text{)}$通过可控极化反转将其“0”/“1”状态编程为不同的FeRAM极化状态,同时利用FeRAM切换过程中的大位移电流将FeRAM状态重新加载回2T0C DRAM。这种混合单元可以实现单元内双向易失性-非易失性传输,作为混合内存层次结构、内存中计算和具有快速更新和持久存储的节能AI的紧凑原语。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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