Dong Min Kim;Yu Bin Kim;Sung Ho Kim;Shivam Kumar Gautam;Hi-Deok Lee
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引用次数: 0
Abstract
Oxide-based memristive synaptic devices are promising hardware elements for neuromorphic computing, but stochastic resistive switching caused by uncontrolled defect distributions and localized conductive paths remains a critical challenge. Here, we demonstrate Zr-doped ZnO memristive synaptic devices fabricated using an atomic layer deposition (ALD) super-cycle process to regulate both defect states and surface morphology. X-ray photoelectron spectroscopy revealed a decrease in the VO-related O 1s component from 34.9% to 23.2%, while atomic force microscopy showed a reduction in RMS surface roughness from 0.7532 to 0.2603 nm with less distinguishable surface-grain features. These results suggest that Zr incorporation suppresses VO-related defects and reduces grain-boundary-assisted localized conduction. Compared with the undoped device, the Zr-doped device exhibited improved switching uniformity, reduced resistance-state variation, stable pulse endurance, and retention for over ${10}^{{4}}$ s at 25, 50, and $75~^{\circ }$ C. The regulated defect distribution and surface morphology enabled gradual and reproducible conductance modulation during long-term potentiation and depression, resulting in improved synaptic linearity. Neural network simulations using experimentally extracted LTP/LTD nonlinearity parameters further demonstrated enhanced recognition accuracy in ANN and CNN classification tasks.
期刊介绍:
IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.