Wideband Intelligent Reflecting Surface for 6G Indoor Communication: Design Considerations and Performance Analysis

IF 3.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2026-09-01 Epub Date: 2026-08-05 DOI:10.1109/TCPMT.2026.3720464

V. Renuga Kanni;Esther Florence Sundarsingh;R. Vimal Samsingh

引用次数: 0

Abstract

This article presents the development of intelligent reflecting surfaces (IRSs) aimed at enhancing 6G indoor communication. The unit-cell design incorporates a circular reflecting element, enhanced with circular rings and a clover-diamond slot. Constructive interference is achieved with a phase tolerance of ±20° within the 11.8–14.37-GHz band, ensuring optimal signal reflection under normal incidence. Directivity is recorded as 19.72 dB, which proves that the proposed IRS has a wide bandwidth. Maximum sidelobe level is found to be −27.28 dB. Specific absorption rate (SAR), recorded for the first time, is found to be 0.139 W/kg for 1-g tissue, which complies with the IEEE standard and makes it suitable for use in indoor applications.

查看原文本刊更多论文

6G室内通信宽带智能反射面：设计考虑与性能分析

本文介绍了旨在增强6G室内通信的智能反射面（IRSs）的发展。单格设计结合了一个圆形反射元素，增强了圆形环和三叶草钻石槽。在11.8 - 14.37 ghz频段内，相位容差为±20°，实现了建设性干扰，确保了正常入射下的最佳信号反射。指向性记录为19.72 dB，证明了所提出的IRS具有较宽的带宽。最大旁瓣电平为−27.28 dB。首次记录的比吸收率（SAR）为0.139 W/kg，符合IEEE标准，适用于室内应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.