Self-Packaged All-Port CM Reflectionless Balanced Filtering Power Divider Based on SISPSL Structure With Broadband CM Absorption

IF 3.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Du Chen;Han-Peng Zheng;Xu Jiang;Feng Wei;Hong-Yu Liu
{"title":"Self-Packaged All-Port CM Reflectionless Balanced Filtering Power Divider Based on SISPSL Structure With Broadband CM Absorption","authors":"Du Chen;Han-Peng Zheng;Xu Jiang;Feng Wei;Hong-Yu Liu","doi":"10.1109/TCPMT.2026.3685442","DOIUrl":null,"url":null,"abstract":"In this article, a self-packaged all-port common-mode (CM) reflectionless balanced filtering power divider (FPD) with high CM suppression and broadband CM absorption is proposed based on substrate-integrated suspended parallel stripline (SISPSL) for the first time. A ring resonator is utilized to provide differential-mode (DM) filtering and power division response based on the Wilkinson power-divider structure. Two transmission zeros (TZs) are generated by employing a ring resonator, significantly improving DM frequency selectivity. Based on the anti-phase-fed double-sided parallel-stripline (DSPSL) structure, a high CM suppression without affecting the DM performance is achieved in the proposed balanced FPD. Furthermore, the CM energy is absorbed by the resistors loaded between the transmission lines, thereby achieving broadband CM reflectionless characteristics. To validate the design, a prototype of the CM reflectionless balanced FPD was designed and fabricated. The measured results show good consistency with simulated data, confirming the feasibility and effectiveness of the proposed approach.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"16 9","pages":"2127-2134"},"PeriodicalIF":3.3000,"publicationDate":"2026-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11488310/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2026/4/20 0:00:00","PubModel":"Epub","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

In this article, a self-packaged all-port common-mode (CM) reflectionless balanced filtering power divider (FPD) with high CM suppression and broadband CM absorption is proposed based on substrate-integrated suspended parallel stripline (SISPSL) for the first time. A ring resonator is utilized to provide differential-mode (DM) filtering and power division response based on the Wilkinson power-divider structure. Two transmission zeros (TZs) are generated by employing a ring resonator, significantly improving DM frequency selectivity. Based on the anti-phase-fed double-sided parallel-stripline (DSPSL) structure, a high CM suppression without affecting the DM performance is achieved in the proposed balanced FPD. Furthermore, the CM energy is absorbed by the resistors loaded between the transmission lines, thereby achieving broadband CM reflectionless characteristics. To validate the design, a prototype of the CM reflectionless balanced FPD was designed and fabricated. The measured results show good consistency with simulated data, confirming the feasibility and effectiveness of the proposed approach.
基于宽带CM吸收SISPSL结构的自封装全端口CM无反射平衡滤波功率分配器
本文首次提出了一种基于衬底集成悬浮平行带状线(SISPSL)的自封装全端口共模(CM)无反射平衡滤波功率分压器(FPD),具有高CM抑制和宽带CM吸收功能。基于威尔金森功率分频器结构,利用环形谐振器提供差模滤波和功率分频响应。采用环形谐振器产生两个传输零点(TZs),显著提高DM频率选择性。基于反相位馈电的双面平行带状线(DSPSL)结构,在不影响DM性能的情况下实现了高CM抑制。此外,CM能量被负载在传输线之间的电阻吸收,从而实现宽带CM无反射特性。为了验证该设计,设计并制作了CM无反射平衡FPD样机。实测结果与仿真数据吻合较好,验证了该方法的可行性和有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信
小红书