The Dynamic Capillary Limits of a Heat Pipe: Mapping the Operating Power Ranges Using a Transient Dryout and Rewetting Model

IF 3.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Shrutika Singh;Justin A. Weibel
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引用次数: 0

Abstract

This work demonstrates the use of a transient model to map the operational limits of a heat pipe based on the time-to-dryout (TTD), evaporator temperature, and time-to-rewet (TTR) in response to dynamic high-power pulses and subsequent throttling. The model considers dynamic coupling between the local liquid saturation and capillary pressure, as well as incorporates wetting hysteresis to predict pulse-load-induced dryout and power-throttling-assisted recovery. Traditional heat pipe design and performance metrics consider the “steady capillary limit” (maximum power at which a steady heat load can be maintained without dryout), but this steady-state framework does not capture the transient power excursions common in modern electronic systems. This work, therefore, puts forth a framework for mapping the “dynamic capillary limits” of a heat pipe as a function of the transient workload of interest. Specifically, the framework produces design-ready operational maps that quantify the TTD, peak evaporator temperature during a pulse ( $T_{evap}$ ), and TTR during throttling—thereby defining dynamic capillary limits beyond the conventional steady capillary limit. These operational maps are effective as tools for assessing the transient limits of performance and can be generated for different heat pipe designs.
热管的动态毛细极限:用瞬态干燥和再润湿模型映射工作功率范围
这项工作展示了使用一个瞬态模型来绘制热管的运行极限,该热管基于对动态高功率脉冲和随后的节流的响应时间到干燥(TTD)、蒸发器温度和再湿时间(TTR)。该模型考虑了局部液体饱和度和毛管压力之间的动态耦合,并考虑了润湿滞后来预测脉冲负载引起的干干和功率节流辅助恢复。传统的热管设计和性能指标考虑“稳定毛细管极限”(在没有干化的情况下可以保持稳定热负荷的最大功率),但这种稳态框架不能捕获现代电子系统中常见的瞬态功率偏移。因此,这项工作提出了一个框架,用于将热管的“动态毛细管极限”映射为感兴趣的瞬态工作量的函数。具体来说,该框架生成了设计准备好的操作图,量化了脉冲期间的TTD、蒸发器峰值温度($T_{evap}$)和节流期间的TTR,从而定义了超出常规稳定毛细管极限的动态毛细管极限。这些操作图是评估性能瞬态极限的有效工具,可以为不同的热管设计生成。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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