Compact IPD Bandpass Filter With Wide Upper Stopband in GaAs Technology

IF 3.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2026-09-01 Epub Date: 2026-07-24 DOI:10.1109/TCPMT.2026.3716634

Gang Zhang;Yuanming Yan;Yichuan Jiang;Zehua Liu;Na Li;Kam-Weng Tam;Shichang Chen

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引用次数: 0

Abstract

A compact bandpass filter (BPF) featuring high selectivity and a wide stopband has been proposed and realized using gallium arsenide (GaAs) integrated passive device (IPD) technology. A developed topology consisting of a T-shape topology and a paralleled capacitor is introduced in this BPF. The T-shape topology can achieve a triple-mode filter response and generate two transmission zeros (TZs) at both sides of the passband, significantly improving the frequency selectivity. This paralleled capacitor can introduce an additional TZ to widen the stopband. For validation, the proposed BPF centered at 3.65 GHz with a 3-dB fractional bandwidth (FBW) of 64% has been fabricated and measured. The measured results show a wide stopband rejection of −20 dB up to 36.7 GHz (about

$10f_{0}$

) and a compact size of

$0.068\lambda _{0} \times 0.052\lambda _{0}$

查看原文本刊更多论文

GaAs技术中具有宽上阻带的紧凑IPD带通滤波器

利用砷化镓（GaAs）集成无源器件（IPD）技术，提出并实现了一种具有高选择性和宽阻带的紧凑型带通滤波器（BPF）。介绍了一种由t型拓扑和并联电容组成的新型BPF拓扑结构。t型拓扑结构可以实现三模滤波器响应，并在通带两侧产生两个传输零点（TZs），显著提高频率选择性。这种并联电容器可以引入额外的TZ以扩大阻带。为了验证所提出的以3.65 GHz为中心，3db分数带宽（FBW）为64%的BPF已被制作和测量。测量结果表明，在36.7 GHz（约$10f_{0}$）范围内具有- 20 dB的宽阻带抑制，紧凑尺寸为$0.068\lambda _{0} \乘以$ 0.052\lambda _{0}$。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.