Cross-Alloy Transfer Learning With Transferability Assessment for Mechanical Property Prediction of Lead-Free Solders

IF 3.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Qais Qasaimeh;Waad Tarman;Daniel F. Silva;Saad Hamasha;Jia Liu
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引用次数: 0

Abstract

The mechanical properties of lead-free solder alloys, including yield strength (YS), ultimate tensile strength (UTS), and elastic modulus, are critical indicators of reliability. These properties are typically obtained through experimental testing; however, generating comprehensive datasets through such experiments is costly and time-consuming, particularly for newly developed alloy systems. To address this limitation, this study proposes a transferability-guided transfer-learning (TL) framework that leverages data-rich conventional alloys (e.g., SAC305) to predict the UTS of newly developed, data-scarce alloys (e.g., Innolot). The proposed framework is benchmarked against conventional machine learning (ML) models, including artificial neural networks, random forests (RFs), Gaussian process regression (GPR), support vector regression (SVR), and extreme gradient boosting, demonstrating superior accuracy and robustness in low-data regimes. For example, for SACQ, TL reduces the mean absolute error (MAE) by more than 50% relative to the best conventional ML model. Transferability analysis is employed to evaluate the effectiveness of knowledge transfer from data-rich source alloys to data-scarce target alloys, indicating stronger transfer to SACQ than to Innolot. In addition, interpretability analysis confirms that the TL model captures physically consistent trends, including strength degradation with increasing temperature and aging, and strengthening with higher strain rates. Overall, this work demonstrates that transferability-guided TL enables accurate prediction of mechanical properties for newly developed alloys using minimal experimental data, reducing cost and accelerating the design of high-reliability lead-free solder materials.
基于可传递性评估的跨合金迁移学习无铅焊料力学性能预测
无铅钎料合金的力学性能,包括屈服强度(YS)、极限抗拉强度(UTS)和弹性模量,是可靠性的关键指标。这些特性通常是通过实验测试获得的;然而,通过这样的实验生成全面的数据集是昂贵和耗时的,特别是对于新开发的合金系统。为了解决这一限制,本研究提出了一个可转移性指导的迁移学习(TL)框架,该框架利用数据丰富的传统合金(例如SAC305)来预测新开发的数据稀缺合金(例如Innolot)的UTS。所提出的框架以传统的机器学习(ML)模型为基准,包括人工神经网络、随机森林(rf)、高斯过程回归(GPR)、支持向量回归(SVR)和极端梯度增强,在低数据状态下显示出卓越的准确性和鲁棒性。例如,对于SACQ,相对于最佳的传统ML模型,TL将平均绝对误差(MAE)降低了50%以上。利用可转移性分析来评价知识从数据丰富的源合金向数据稀缺的目标合金转移的有效性,表明知识向SACQ的转移强于向innoot的转移。此外,可解释性分析证实,TL模型捕获了物理上一致的趋势,包括强度随温度和时效升高而下降,以及随应变率升高而增强。总的来说,这项工作表明,可转移性引导TL能够使用最少的实验数据准确预测新开发的合金的机械性能,降低成本并加速高可靠性无铅焊料材料的设计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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