Surface-Relief-Treated 940-nm VCSELs for High Beam Quality in Proximity Sensing

IF 3.6 2区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Electron Devices Pub Date : 2026-09-01 Epub Date: 2026-07-22 DOI:10.1109/TED.2026.3713123

Yu-Ying Chen;Yuan-He Cai;Hua-Xin Xiong;Yi-Feng Huang;Li-Hong Zhu;Wei-Jie Guo;Yi-Jun Lu;Hao-Chung Kuo;Zhong Chen;Ting-Zhu Wu

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Abstract

We designed, fabricated, and characterized a high-performance 940-nm vertical-cavity surface-emitting laser (VCSEL) that incorporates a surface-relief (SR) structure to enhance beam quality and maintain modal stability. The SR aperture was optimized through optical-electro simulations to suppress higher order transverse modes via locally reducing reflectivity at the aperture periphery while maintaining low threshold current and high power. The fabricated VCSEL exhibits a low threshold current of

$2\sim 2.1$

mA and delivers

$19.4\sim 20.5$

mW of maximum output power under

$33\sim 34$

-mA continuous-wave (CW) operation. Far-field measurements confirm a significantly reduced beam divergence of 12.9° under 10 mA, with a quasi-Gaussian profile indicative of robust fundamental mode confinement. These results highlight the potential of SR-treated VCSELs for compact, high-precision photonic applications such as proximity sensing in next-generation devices.

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近距离传感中用于高光束质量的表面浮雕处理940nm VCSELs

我们设计、制造并表征了一种高性能的940纳米垂直腔面发射激光器（VCSEL），该激光器采用表面浮雕（SR）结构来提高光束质量并保持模态稳定性。通过光电仿真优化了SR孔径，通过局部降低孔径周边的反射率来抑制高阶横向模式，同时保持低阈值电流和高功率。制造的VCSEL具有低阈值电流，为$2\sim 2.1$ mA，并在$33\sim 34$ mA的连续波（CW）工作下提供$19.4\sim 20.5$ mW的最大输出功率。远场测量证实，在10 mA下，光束发散度显著降低了12.9°，具有准高斯分布，表明具有强大的基模约束。这些结果突出了sr处理的vcsel在紧凑、高精度光子应用（如下一代器件中的接近传感）方面的潜力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Electron Devices 工程技术-工程：电子与电气

CiteScore

5.80

自引率

16.10%

发文量

937

审稿时长

3.8 months

期刊介绍： IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.