Toward Understanding Threshold Voltage Shift Induced by Gate-to-Sinker Spacing Scaling in 12 V n-LDMOSFET

IF 3.6 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electron Devices Pub Date : 2026-09-01 Epub Date: 2026-08-05 DOI:10.1109/TED.2026.3716669
Ching-Huei Tsai;Jian-Bin Shiu;Shuenn-Jeng Chen;Yi-Min Jen;Tian-Li Wu
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引用次数: 0

Abstract

This work presents a systematic investigation of the impact of gate-to-sinker Lgsink scaling on threshold voltage Vth stability of n-type lateral double-diffused MOS (n-LDMOS). The effects of Lgsink were examined experimentally. A unique dependence of threshold voltage on gate-to-sinker spacing was identified, originating from boron diffusion of the P++ sinker into the channel and drain LDD regions during high-temperature drive-in. This mechanism was validated by secondary ion mass spectrometry (SIMS) profiling, which directly demonstrated boron penetration beneath the channel. The increased channel doping accounts for the observed rise in threshold voltage and reduction in drive current. These findings highlight the necessity of co-optimizing geometric scaling and diffusion control to achieve better control of Vth in advanced lateral double-diffused metal-oxide-semiconductor (LDMOS) technologies.
对12v n-LDMOSFET栅极-陷子间距缩放引起的阈值电压偏移的理解
本文系统地研究了栅极到栅极的Lgsink缩放对n型横向双扩散MOS (n-LDMOS)阈值电压Vth稳定性的影响。实验考察了Lgsink的作用。研究发现,阈值电压与栅极-下沉器间距有独特的关系,这是由于高温驱动过程中,p++下沉器的硼扩散到通道和漏极LDD区域造成的。二级离子质谱(SIMS)分析证实了这一机制,直接证实了硼在通道下方的渗透。通道掺杂的增加是阈值电压升高和驱动电流减小的原因。这些发现强调了在先进的横向双扩散金属氧化物半导体(LDMOS)技术中,协同优化几何缩放和扩散控制以更好地控制Vth的必要性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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