Electric Gain Effect in LWIR ICIPs Under Thermoelectric Cooling (200/230 K)

IF 3.6 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electron Devices Pub Date : 2026-09-01 Epub Date: 2026-09-07 DOI:10.1109/TED.2026.3720450
Karol Dąbrowski;Piotr Baranowski;Bartłomiej Seredyński;Łukasz Kubiszyn;Waldemar Gawron;Piotr Martyniuk
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引用次数: 0

Abstract

This article presents an analysis of the electric gain in interband cascade infrared photodetectors (ICIPs) impacting the final performance of the long-wavelength infrared (LWIR) detectors fabricated in VIGO Photonics S.A. (VIGO) and optimized for 200 and 230 K. The aim is to illustrate the presence of the gain in selected ICIP structures, as well as to demonstrate its dependence on the carrier diffusion length and series resistance versus operating temperatures. All analyzed devices are based on the InAs/InAsSb type-II superlattice (T2SLs) with subsequent cells connected by highly doped p+/n+ tunnel junctions. Additionally, to increase the optical area and signal-to-noise ratio, immersion lenses were processed in all devices. This article focuses on the electric gain analysis, being defined as the ratio of the measured current responsivity and the theoretically simulated one based on the active layer absorption coefficient. Furthermore, this article presents the impact of a double radiation pass through the last stage of the cascade structure after its reflection from the metallization on quantum efficiency (QE), current responsivity, and gain from the simulations.
热电冷却(200/230 K)下LWIR ICIPs的电增益效应
本文分析了带间级联红外探测器(ICIPs)的电增益对VIGO Photonics S.A. (VIGO)制造的200和230 K优化的长波红外探测器(LWIR)最终性能的影响。目的是说明在选定的ICIP结构中增益的存在,以及证明其与载流子扩散长度和串联电阻对工作温度的依赖。所有分析的器件都基于InAs/InAsSb ii型超晶格(T2SLs),随后的电池通过高掺杂的p+/n+隧道结连接。此外,为了增加光学面积和信噪比,所有器件都对浸没透镜进行了处理。本文的重点是分析电增益,它被定义为测量电流响应率与基于有源层吸收系数的理论模拟电流响应率之比。此外,本文还通过模拟给出了金属化反射后双辐射通过级联结构最后一级对量子效率(QE)、电流响应度和增益的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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