{"title":"Two-Level Pareto-Based Hierarchical Reinforcement Learning for Dynamic Multi-Objective Scheduling in Semiconductor Fabs","authors":"Chin-Yi Lin;Tzu-Liang Tseng;Tsung-Han Tsai","doi":"10.1109/TSM.2026.3704324","DOIUrl":null,"url":null,"abstract":"This paper addresses the critical challenges of dynamic, multi-objective scheduling in semiconductor wafer manufacturing, where decision makers must balance conflicting goals such as throughput, yield, cycle time, and energy efficiency amid frequent disruptions and large-scale complexity. We propose a novel Pareto-based Hierarchical Multi-Objective Reinforcement Learning (PH-MORL) framework, which integrates the exploration of Pareto-optimal trade-offs with a hierarchical decision structure. The high-level agent adaptively determines global objective pReferences by referencing a continuously maintained Pareto archive, capturing a diverse set of non-dominated solutions. These preferences are then broadcast to low-level agents that learn fine-grained scheduling actions for individual workstations. Through this dual-layer synergy, PH-MORL overcomes the limitations of fixed-weight multi-objective methods and single-layer learning architectures, enabling real-time reconfiguration of scheduling strategies in response to machine failures, urgent orders, or yield fluctuations. The proposed framework not only discovers a broad spectrum of feasible performance compromises but also dynamically coordinates local and global decision making. Our formal analysis establishes tracking and stability properties under standard finite-state stochastic-approximation and contraction assumptions, while extensive discrete-event simulation experiments in realistic wafer-fab settings demonstrate improved dynamic scheduling trade-offs, real-time inference feasibility, and competitive performance against rolling-horizon NSGA-II/III baselines. We further provide CPU-only end-to-end inference measurements that include state-feature assembly, feasible-action enumeration and masking, neural-network inference, rule-based safety filtering, and dispatch commitment. Across 30 independent 240-hour replications, PH-MORL achieves 15.7 ms mean latency, 31.5 ms p95 latency, 50.3 ms p99 latency, and 182.0 ms maximum latency, remaining well below the 1 s dispatching budget required for real-time dispatching in modern 300 mm fabs. These results highlight PH-MORL’s potential for scalable and flexible optimization in modern semiconductor manufacturing, and its generalizable structure paves the way for broader adoption in other complex, multi-objective industrial environments.","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"39 3","pages":"590-613"},"PeriodicalIF":2.5000,"publicationDate":"2026-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Semiconductor Manufacturing","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11569966/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2026/6/17 0:00:00","PubModel":"Epub","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This paper addresses the critical challenges of dynamic, multi-objective scheduling in semiconductor wafer manufacturing, where decision makers must balance conflicting goals such as throughput, yield, cycle time, and energy efficiency amid frequent disruptions and large-scale complexity. We propose a novel Pareto-based Hierarchical Multi-Objective Reinforcement Learning (PH-MORL) framework, which integrates the exploration of Pareto-optimal trade-offs with a hierarchical decision structure. The high-level agent adaptively determines global objective pReferences by referencing a continuously maintained Pareto archive, capturing a diverse set of non-dominated solutions. These preferences are then broadcast to low-level agents that learn fine-grained scheduling actions for individual workstations. Through this dual-layer synergy, PH-MORL overcomes the limitations of fixed-weight multi-objective methods and single-layer learning architectures, enabling real-time reconfiguration of scheduling strategies in response to machine failures, urgent orders, or yield fluctuations. The proposed framework not only discovers a broad spectrum of feasible performance compromises but also dynamically coordinates local and global decision making. Our formal analysis establishes tracking and stability properties under standard finite-state stochastic-approximation and contraction assumptions, while extensive discrete-event simulation experiments in realistic wafer-fab settings demonstrate improved dynamic scheduling trade-offs, real-time inference feasibility, and competitive performance against rolling-horizon NSGA-II/III baselines. We further provide CPU-only end-to-end inference measurements that include state-feature assembly, feasible-action enumeration and masking, neural-network inference, rule-based safety filtering, and dispatch commitment. Across 30 independent 240-hour replications, PH-MORL achieves 15.7 ms mean latency, 31.5 ms p95 latency, 50.3 ms p99 latency, and 182.0 ms maximum latency, remaining well below the 1 s dispatching budget required for real-time dispatching in modern 300 mm fabs. These results highlight PH-MORL’s potential for scalable and flexible optimization in modern semiconductor manufacturing, and its generalizable structure paves the way for broader adoption in other complex, multi-objective industrial environments.
期刊介绍:
The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.